Inhaltsangabe
Language:Chinese.paperback.Pub Date:2024-10.publisher:Chemical Industry Press.description:Paperback. Pub Date: 2024-10 Pages: 236 Publisher: Chemical Industry Press This book systematically and comprehensively summarizes the fundamental knowledge and technologies of modern electronic packaging science. Part I provides an overview of elect
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Suchergebnisse für Advanced electronic packaging technology(Chinese Edition)
Beispielbild für diese ISBN
Advanced electronic packaging technology(Chinese Edition)
Anbieter: liu xing, Nanjing, JS, China
Verkäuferbewertung 5 von 5 Sternen
paperback. Zustand: New. Language:Chinese.Paperback. Pub Date: 2024-10 Pages: 236 Publisher: Chemical Industry Press This book systematically and comprehensively summarizes the fundamental knowledge and technologies of modern electronic packaging science. Part I provides an overview of electronic packaging technologies. including important packaging fundamentals such as wire bonding. automatic tape bonding. flip chip solder joint bonding. microbump bonding. and CUCU direct bonding. Part II introduces the circuit desi. Bestandsnummer des Verkäufers DT050389
Neu kaufen
EUR 149,64
EUR 15,44 Versand
Versand von China nach USA
Versand von China nach USA
Anzahl: 1 verfügbar