Suchergebnisse für 电子封装材料与...
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Electronic Packaging Materials and Processes (3) of the original(Chinese Edition)
Anbieter: liu xing, Nanjing, JS, China
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paperback. Zustand: New. Paperback. Pub Date: 2006 Pages: 635 Publisher: Chemical Industry Press book by the work of experts in various fields in the first line of the electronic package written concerning electronic packaging materials and technology and related fields. including semiconductor. plastics . rubber. composite materials. ceramics and glass. and metal and other materials. the material also including soldering of electronic packaging and assembly. electroplating and depositing a metal coating. the manufac. Bestandsnummer des Verkäufers CB021997
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