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Language:Chinese.paperback.Pub Date:2025-01.publisher:Northeastern University Press.description:Paperback. Pub Date: 2025-01 Pages: 164 Publisher: Northeastern University Press Three-dimensional vertical seismic profiling (3D-VSP) multi-wave data processing is a systematic engineering project. This book details 3D-VSP exploration technology and
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3D-VSP Multiwave Data Processing and Interpretation(Chinese Edition)
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Northeastern University Press, 2025
ISBN 10: 7551735585
ISBN 13: 9787551735582
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paperback. Zustand: New. Language:Chinese.Paperback. Pub Date: 2025-01 Pages: 164 Publisher: Northeastern University Press Three-dimensional vertical seismic profiling (3D-VSP) multi-wave data processing is a systematic engineering project. This book details 3D-VSP exploration technology and studies its application in conjunction with rock and rock property parameter variations. It combines seismic profile and well logging data for wavelet extraction. seismic record synthesis. profile compression. stratigraphic compa. Bestandsnummer des Verkäufers DT049377
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