Language:Chinese.No Binding.publisher:Harbin Engineering University Press Pub. Date :200.description:Pages Number: 240 Publisher: Harbin Engineering University Press Pub. Date :2009-08. This book is composed of three parts: First. the identification chip components and desoldering; Second. various types of SMD diodes. and diode combination
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Anbieter: liu xing, Nanjing, JS, China
paperback. Zustand: New. Language:Chinese.Pages Number: 240 Publisher: Harbin Engineering University Press Pub. Date :2009-08. This book is composed of three parts: First. the identification chip components and desoldering; Second. various types of SMD diodes. and diode combination. Bestandsnummer des Verkäufers J50194
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