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Thermal Challenges in Next Generation Electronic Systems: Proceedings of the Thermes 2002 Conference, Santa Fe, New Mexico, USA, January 13-16, 2002 - Hardcover
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Joshi (mechanical engineering, Georgia Institute of Technology) and Garimella (mechanical engineering, Purdue U.) present 44 papers from the January 2002 conference that explore issues of thermal management in electronic products of a range of sizes, although the progression of shrinking system sizes is of particular concern. After the nine keynote and invited lectures, the papers are organized under the following categories: challenges in micro- and nano-scale transport, novel thermal management concepts, high heat flux transport, transport in thermal management materials and across interfaces, heat pipes and thermosyphons, compact models, design methodologies, and analysis and testing methods. The text does not note what the CD-ROM contains. Annotation (c) Book News, Inc., Portland, OR (booknews.com)
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Thermal Challenges in Next Generation Electronic Systems - Proceedings of the THERMES 2002 Conference, Santa Fe, New Mexico, USA, January 13-16, 2002
Anbieter: Mom's Resale and Books, River Hills, WI, USA
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Hardcover. Zustand: Very Good. 2002 Hardcover Edition. Book ONLY-NO CD. Pages clean & unmarked. No Dj issued. Faint shelf wear to cover. Bestandsnummer des Verkäufers 12F-4-25-22-02
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