[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel’s very recently announced 80-core TeraFLOP chip [5] exemplifies the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual displacement of the computati- centric design model by a more communication-centric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p- cessing elements working in tandem. This trend has led to a surge in the popularity of multi-core systems, which typically manifest themselves in two distinct incarnations: heterogeneous Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip Multi-Processors (CMP). The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced Time-To- Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of pre-existing IP components integrated on a single die.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
The continuing reduction of feature sizes into the nanoscale regime has led to dramatic increases in transistor densities. Integration at these levels has highlighted the criticality of the on-chip interconnects. Network-on-Chip (NoC) architectures are viewed as a possible solution to burgeoning global wiring delays in many-core chips, and have recently crystallized into a significant research domain. On-chip networks instill a new flavor to communication research due to their inherently resource-constrained nature. Despite the lightweight character demanded of the NoC components, modern designs require ultra-low communication latencies in order to cope with inflating data bandwidths. The work presented in Network-on-Chip Architectures addresses these issues through a comprehensive exploration of the design space. The design aspects of the NoC are viewed through a penta-faceted prism encompassing five major issues: (1) performance, (2) silicon area consumption, (3) power/energy efficiency, (4) reliability, and (5) variability. These five aspects serve as the fundamental design drivers and critical evaluation metrics in the quest for efficient NoC implementations. The research exploration employs a two-pronged approach: (a) MICRO-architectural innovations within the major NoC components, and (b) MACRO-architectural choices aiming to seamlessly merge the interconnection backbone with the remaining system modules. These two research threads and the aforementioned five key metrics mount a holistic and in-depth attack on most issues surrounding the design of NoCs in multi-core architectures.
„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
EUR 28,76 für den Versand von Vereinigtes Königreich nach USA
Versandziele, Kosten & DauerEUR 13,78 für den Versand von Vereinigtes Königreich nach USA
Versandziele, Kosten & DauerAnbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
Zustand: New. In. Bestandsnummer des Verkäufers ria9789400730496_new
Anzahl: Mehr als 20 verfügbar
Anbieter: GreatBookPrices, Columbia, MD, USA
Zustand: New. Bestandsnummer des Verkäufers 18263950-n
Anzahl: 15 verfügbar
Anbieter: Grand Eagle Retail, Bensenville, IL, USA
Paperback. Zustand: new. Paperback. [2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intels very recently announced 80-core TeraFLOP chip [5] exemplifies the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual displacement of the computati- centric design model by a more communication-centric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p- cessing elements working in tandem. This trend has led to a surge in the popularity of multi-core systems, which typically manifest themselves in two distinct incarnations: heterogeneous Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip Multi-Processors (CMP). The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced Time-To- Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of pre-existing IP components integrated on a single die. The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Bestandsnummer des Verkäufers 9789400730496
Anzahl: 1 verfügbar
Anbieter: Lucky's Textbooks, Dallas, TX, USA
Zustand: New. Bestandsnummer des Verkäufers ABLIING23Apr0412070049924
Anzahl: Mehr als 20 verfügbar
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel's very recently announced 80-core TeraFLOP chip [5] exemplifies the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual displacement of the computati- centric design model by a more communication-centric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p- cessing elements working in tandem. This trend has led to a surge in the popularity of multi-core systems, which typically manifest themselves in two distinct incarnations: heterogeneous Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip Multi-Processors (CMP). The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced Time-To- Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of pre-existing IP components integrated on a single die. 248 pp. Englisch. Bestandsnummer des Verkäufers 9789400730496
Anzahl: 2 verfügbar
Anbieter: moluna, Greven, Deutschland
Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. A comprehensive study of Network-on-Chip architectures for multi-core chipsAnalysis of complex interplay between various design evaluation metricsDetailed look at both macro- and micro-architectural design issuesInnovative solutions . Bestandsnummer des Verkäufers 5826111
Anzahl: Mehr als 20 verfügbar
Anbieter: California Books, Miami, FL, USA
Zustand: New. Bestandsnummer des Verkäufers I-9789400730496
Anzahl: Mehr als 20 verfügbar
Anbieter: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irland
Zustand: New. NoC architectures are seen as a possible solution to burgeoning global wiring delays in many-core chips, and this work deals with the main issues that need to be resolved in performance, energy efficiency, reliability, variability and silicon area consumption. Series: Lecture Notes in Electrical Engineering. Num Pages: 245 pages, biography. BIC Classification: TJFC; UYD; UYF. Category: (G) General (US: Trade). Dimension: 235 x 155 x 13. Weight in Grams: 385. . 2012. 2010th Edition. paperback. . . . . Bestandsnummer des Verkäufers V9789400730496
Anzahl: 15 verfügbar
Anbieter: Books Puddle, New York, NY, USA
Zustand: New. pp. 248. Bestandsnummer des Verkäufers 2614418744
Anzahl: 4 verfügbar
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Zustand: New. PRINT ON DEMAND pp. 248. Bestandsnummer des Verkäufers 1814418738
Anzahl: 4 verfügbar