This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic Growth. ) Electronics Packaging has been receiving significant visibility in recent years as it has become obvious that the near-future limitations to the continued development of high performance electronic chips will arise from technological problems in their packaging. The two most obvious of these are the escalating difficulties of removing Joule heat from circuits packed ever more closely together, and the problem of providing more and more electrical contacts to smaller and smaller packages. As recognition of these problems has developed, organizations such as NSF, SRC and MCC have joined with industry in calling for increased research effort in the area. The Materials Research Society and other professional scientific groups have introduced Electronics Packaging sessions into their conference programs, and the International Electronics Packaging Society (IEPS) is expanding rapidly. The field is inherently multi-disciplinary, incorporating several of the traditional sub-areas of Mechanical and Electrical Engineering, Physics and Chemistry.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Anbieter: Brook Bookstore On Demand, Napoli, NA, Italien
Zustand: new. Questo è un articolo print on demand. Bestandsnummer des Verkäufers RSVQOXX9JG
Anzahl: Mehr als 20 verfügbar
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
Zustand: New. In. Bestandsnummer des Verkäufers ria9789401092883_new
Anzahl: Mehr als 20 verfügbar
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic Growth. ) Electronics Packaging has been receiving significant visibility in recent years as it has become obvious that the near-future limitations to the continued development of high performance electronic chips will arise from technological problems in their packaging. The two most obvious of these are the escalating difficulties of removing Joule heat from circuits packed ever more closely together, and the problem of providing more and more electrical contacts to smaller and smaller packages. As recognition of these problems has developed, organizations such as NSF, SRC and MCC have joined with industry in calling for increased research effort in the area. The Materials Research Society and other professional scientific groups have introduced Electronics Packaging sessions into their conference programs, and the International Electronics Packaging Society (IEPS) is expanding rapidly. The field is inherently multi-disciplinary, incorporating several of the traditional sub-areas of Mechanical and Electrical Engineering, Physics and Chemistry. 360 pp. Englisch. Bestandsnummer des Verkäufers 9789401092883
Anzahl: 2 verfügbar
Anbieter: Books Puddle, New York, NY, USA
Zustand: New. pp. 360. Bestandsnummer des Verkäufers 26127971179
Anzahl: 4 verfügbar
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
Zustand: New. Print on Demand pp. 360 23:B&W 6 x 9 in or 229 x 152 mm Perfect Bound on White w/Gloss Lam. Bestandsnummer des Verkäufers 131535028
Anzahl: 4 verfügbar
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
Paperback. Zustand: Brand New. reprint edition. 360 pages. 9.02x5.98x0.55 inches. In Stock. Bestandsnummer des Verkäufers x-9401092885
Anzahl: 2 verfügbar
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Zustand: New. PRINT ON DEMAND pp. 360. Bestandsnummer des Verkäufers 18127971169
Anzahl: 4 verfügbar
Anbieter: moluna, Greven, Deutschland
Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year s presentations at the annual Electronics Packaging Symposium, which is run at the State Unive. Bestandsnummer des Verkäufers 5835535
Anzahl: Mehr als 20 verfügbar
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic Growth. ) Electronics Packaging has been receiving significant visibility in recent years as it has become obvious that the near-future limitations to the continued development of high performance electronic chips will arise from technological problems in their packaging. The two most obvious of these are the escalating difficulties of removing Joule heat from circuits packed ever more closely together, and the problem of providing more and more electrical contacts to smaller and smaller packages. As recognition of these problems has developed, organizations such as NSF, SRC and MCC have joined with industry in calling for increased research effort in the area. The Materials Research Society and other professional scientific groups have introduced Electronics Packaging sessions into their conference programs, and the International Electronics Packaging Society (IEPS) is expanding rapidly. The field is inherently multi-disciplinary, incorporating several of the traditional sub-areas of Mechanical and Electrical Engineering, Physics and Chemistry.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 360 pp. Englisch. Bestandsnummer des Verkäufers 9789401092883
Anzahl: 1 verfügbar
Anbieter: preigu, Osnabrück, Deutschland
Taschenbuch. Zustand: Neu. Electronics Packaging Forum | Volume One | James E. Morris | Taschenbuch | x | Englisch | 2012 | Springer | EAN 9789401092883 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. Bestandsnummer des Verkäufers 105330057
Anzahl: 5 verfügbar