Transactions on Engineering Technologies: World Congress on Engineering 2019 - Hardcover

Hardcover

ISBN 10: 9811582726 ISBN 13: 9789811582721

Verlag: Springer, 2020

Inhaltsangabe

This book contains a selection of research articles written by prominent researchers participating in The 27th World Congress on Engineering (WCE 2019) which was held in London, UK, July 3-5, 2019. 

Topics covered include engineering mathematics, electrical engineering, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications. With contributions carefully chosen to represent the most cutting-edge research presented during the conference, the book contains some of the state of the art in engineering technologies and the physical sciences and their applications and serves as a useful reference for researchers and graduate students working in these fields.

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Über die Autorin bzw. den Autor

Dr. Sio-Iong Ao finished his doctoral research at The University of Hong Kong and postdoctoral researches at the University of Oxford and Harvard University and is a former Visiting Professor of Cranfield University, UK, and University of Wyoming, USA.

Len Gelman, PhD, Dr. of Sciences (Habilitation) joined HuddersfieldUniversity as Professor, Chair in Signal Processing/ Condition Monitoring and Director of Centre for Efficiency and Performance Engineering, in 2017 from Cranfield University, where he worked as Professor and Chair in Vibro-Acoustical Monitoring since 2002.

Len developed novel condition monitoring technologies for aircraft engines, gearboxes, bearings, turbines and centrifugal compressors. Len published more than 250 publications, 17 patents and is co-editor of 11 Springer books. He is Fellow of:BINDT, International Association of Engineers and Institutionof Diagnostic Engineers, Executive Director, International Society for Condition Monitoring, Honorary Technical Editor, International Journal of Condition Monitoring, Editor-in-Chief, International Journal of Engineering Sciences (SCMR),Chair, annual International Condition Monitoring Conferences, Honorary Co-Chair, annual World Congresses of Engineering, Co-Chair, International Conference COMADEM 2019 and  Chair, International Scientific Committee of Third World Congress, Condition Monitoring.

He was General Chair,First World Congress, Condition Monitoring, Chair, Second World Congress, Engineering Asset Management and Chair, International Committee of Second World Congress, Condition Monitoring.Len is Chair of International CM Groups of ICNDT and EFNDT and Member of ISO Technical Committee, Condition Monitoring. Len made 42 plenary keynotes at major international conferences. He was Visiting Professor at ten Universities abroad.

Professor Haeng-Kon Kim is a Vice President of Research and Information, a Dean of engineering college and a Professor in the Department of Computer Engineering Catholic University of Daegu, in Korea. He has been a research staff member in Bell Lab. and NASA Center in USA. Professor Kim is Chief Editor of KIPS SE-Sig journal and Korea Multimedia Society, an editorial board of KISS (Korea Information Science Society) and a steering committee of KIPS (Korea Information Processing Society).

Von der hinteren Coverseite

This book contains a selection of research articles written by prominent researchers participating in The 27th World Congress on Engineering (WCE 2019) which was held in London, UK, July 3 5, 2019. 

Topics covered include engineering mathematics, electrical engineering, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications. With contributions carefully chosen to represent the most cutting-edge research presented during the conference, the book contains some of the state of the art in engineering technologies and the physical sciences and their applications and serves as a useful reference for researchers and graduate students working in these fields.

Details zur Ausgabe

• Verlag: Springer
• Erscheinungsdatum: 2020
• ISBN 10: 9811582726
• ISBN 13: 9789811582721
• Einband: Tapa dura
• Sprache: Englisch
• Auflage: 1
• Anzahl der Seiten: 260
• Herausgeber: Ao Sio-Iong, Gelman Len, Kim Haeng Kon
• Kontakt zum Hersteller: Nicht verfügbar