Introduction to Thermal Cloaking: Theory and Analysis in Conduction and Convection - Hardcover

Yeung, Woon-Shing; Yang, Ruey-Jen

Hardcover

ISBN 10: 981167549X ISBN 13: 9789811675492

Verlag: Springer, 2021

Inhaltsangabe

This book introduces the fundamental concepts of thermal cloaking based on transformation theory and bilayer theory, under the conduction and convection heat transfer modes. It focuses on thermal cloaking with detailed explanations of the underlying theoretical bases leading to the primary thermal cloaking results in open literature, from an engineering perspective, and with practical application in mind. Also, the authors strive to present the materials with an emphasis on the related physical phenomena and interpretation, to the extent possible. Through this book, engineering students can grasp the fundamental ideas of thermal cloaking and the associated mathematics, thus being better able to initiate their own research and explore new ideas in thermal cloaking.  

While not intended to be a general reference in the vast field of thermal cloaking research, this book is a unique monograph addressing the theoretical and analytical aspects of thermal cloaking within the scope mentioned above. This book also contains many independent analytical solutions to thermal cloaking problems that are not available in open literature. It is suitable for a three-credit graduate or advanced undergraduate course in engineering science.

 

Über diesen Titel

Über die Autorin bzw. den Autor

Woon-Shing Yeung: Since receiving his Ph.D. from the University of California at Berkeley in 1979, Dr. Yeung has spent over ten years in academia teaching in the Mechanical Engineering Department at the University of Massachusetts at Lowell, and over 25 years working in industry in the USA. Currently, he is a Visiting Specialist at National Cheng Kung University in Taiwan, engaging in thermal cloaking research and teaching, and has co-authored a few publications on thermal cloaking.  

Ruey-Jen Yang: Dr. Yang has worked in industry in the USA for over 10 years after receiving his Ph.D. from the University of California at Berkeley in 1982. Professor Yang joined the National Cheng Kung University since 1993 and currently is a Chair Professor and a research fellow of the Taiwan Ministry of Science and Technology. He is also a fellow of the American Society of Mechanical Engineers (ASME) and Society of Theoretical and Applied Mechanics (STAM). His research focuses on Fluid/Thermal Sciences, Microfluidics and Energy Conversion.   

Von der hinteren Coverseite

This book introduces the fundamental concepts of thermal cloaking based on transformation theory and bilayer theory, under the conduction and convection heat transfer modes. It focuses on thermal cloaking with detailed explanations of the underlying theoretical bases leading to the primary thermal cloaking results in open literature, from an engineering perspective, and with practical application in mind. Also, the authors strive to present the materials with an emphasis on the related physical phenomena and interpretation, to the extent possible. Through this book, engineering students can grasp the fundamental ideas of thermal cloaking and the associated mathematics, thus being better able to initiate their own research and explore new ideas in thermal cloaking.  

While not intended to be a general reference in the vast field of thermal cloaking research, this book is a unique monograph addressing the theoretical and analytical aspects of thermal cloaking within the scope mentioned above. This book also contains many independent analytical solutions to thermal cloaking problems that are not available in open literature. It is suitable for a three-credit graduate or advanced undergraduate course in engineering science.

 

Details zur Ausgabe

• Verlag: Springer
• Erscheinungsdatum: 2021
• Sprache: Englisch
• ISBN 10: 981167549X
• ISBN 13: 9789811675492
• Einband: Gebundene Ausgabe
• Auflage: 1
• Anzahl der Seiten: 276
• Kontakt zum Hersteller: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com; ; Europaplatz 3; Heidelberg; 69115; Deutschland