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Thermal Reliability of Power Semiconductor Device in the Renewable Energy System (CPSS Power Electronics Series) - Hardcover

Du, Xiong; Zhang, Jun; Li, Gaoxian; Yu, Yaoyi; Qian, Cheng; Du, Rui

 
9789811931314: Thermal Reliability of Power Semiconductor Device in the Renewable Energy System (CPSS Power Electronics Series)
Hardcover
ISBN 10: 9811931313 ISBN 13: 9789811931314
Verlag: Springer, 2022

Inhaltsangabe

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 

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Über die Autorin bzw. den Autor

Xiong Du obtained his B.S., M.S., and Ph. D. degrees from Chongqing University, China in 2000, 2002, and 2005 respectively, all in the Electrical Engineering. He has been with Chongqing University since 2002 and is currently a full professor in the School of Electrical Engineering, Chongqing University. He was a visiting scholar at Rensselaer Polytechnic Institute, Troy, NY from July 2007 to July 2008. His research interests include power electronics system reliability and stability. He is a recipient of the National Excellent Doctoral Dissertation of P.R. China in 2008.

Jun Zhang obtained his B.S. degree from Anhui University, China, in 2014 and Ph. D. degree from Chongqing University, China, in 2019, all in the Electrical Engineering. He is currently working as a lecture in the College of Energy and Electrical Engineering, Hohai University, Nanjing, China. His research interests include the reliability of power electronics system.

Von der hinteren Coverseite

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 

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Verlag
Springer
Erscheinungsdatum
2022
Sprache
Englisch
ISBN 10 
9811931313
ISBN 13 
9789811931314
Einband
Gebundene Ausgabe
Auflage
1
Anzahl der Seiten
188
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