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DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS (WSPC Series in Advanced Integration and Packaging, 2, Band 2) - Hardcover

Buch 2 von 7: WSPC Series in Advanced Integration and Packaging

SWAMINATHAN, MADHAVAN; HAN, KI JIN

 
9789814508599: DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS (WSPC Series in Advanced Integration and Packaging, 2, Band 2)
Hardcover
ISBN 10: 9814508594 ISBN 13: 9789814508599
Verlag: World Scientific, 2013

Inhaltsangabe

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

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Von der hinteren Coverseite

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.

Verlag
World Scientific
Erscheinungsdatum
2013
Sprache
Englisch
ISBN 10 
9814508594
ISBN 13 
9789814508599
Einband
Gebundene Ausgabe
Anzahl der Seiten
380
Kontakt zum Hersteller
preigu GmbH & Co. KG
mail@preigu.de

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