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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration - Softcover

Lau, John; Fan, Xuejun

 
9789819641680: Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Softcover
ISBN 10: 9819641683 ISBN 13: 9789819641680
Verlag: Springer-Verlag GmbH, 2026

Inhaltsangabe

The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.

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Verlag
Springer-Verlag GmbH
Erscheinungsdatum
2026
Sprache
Englisch
ISBN 10 
9819641683
ISBN 13 
9789819641680
Einband
Tapa blanda
Anzahl der Seiten
672
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