Advanced Wirebond Interconnection Technology

Shankara K Prasad

ISBN 10: 1402077629 / ISBN 13: 9781402077623

Verlag: Springer Us Apr 2004, 2004

Beschreibung

Neuware - Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way. Bestandsnummer des Verkäufers 9781402077623

Bibliografische Details

Titel: Advanced Wirebond Interconnection Technology

Verlag: Springer Us Apr 2004

Erscheinungsdatum: 2004

Einband: Taschenbuch

Zustand: Neu

Über diesen Titel

Inhaltsangabe:

From the reviews:

"This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and automatic bonders for a product line are included.

The book is very good with "visual" explanations for quick grasping of the issues. In addition, the fundamental metallurgical or mechanical root causes behind material and process choices are presented.

The book has a clear prose style and a very readable font and page layout. The figures, although effective, are simply low resolution screen prints from a personal computer and thus have aliasing and fuzziness.

This book has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. The majority of the book dwells on establishing the bonding process for a particular product; determining the "window" of adjustments. The book ends with discussions on establishing quality metrics and reliability assurance tests.

Each chapter of the book includes enough tutorial information to allow it to alone with little need to page backwards. A short but good reference section is at the end.

If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." ( CMPT Newsletter, June 2005)

Críticas:

From the reviews:

"....intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers.... This book has excellent overall tutorial and enough description of wire and bonding equipment.... If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." (IEEE CPMT, Newsletter)

"This book is intended for an assembly ... . is very good with ‘visual’ explanations for quick grasping of the issues. ... The book has a clear prose style and a very readable font and page layout. ... has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. ... A short but good reference section is at the end." (David W. Palmer, IEEE / CPUT Newsletter, Vol. 28 (2), 2005)