Advances in Thermal Modeling of Electronic Components and Systems, Vol. 2

Bar-Cohen, Avram; & Allan D. Kraus

ISBN 10: 0791800156 / ISBN 13: 9780791800157

Verlag: American Society of Mechanical Engineers, New York, 1990

Beschreibung

Volume 2. Ex-Corporate Library copy; with typical markings. Library label on front board and on spine tail. Light bumping on spine extremities and board corners. Pages clean, but for library markings. ; TEH22A; 437 pages; Ex-Library.

Bestandsnummer des Verkäufers 56984

Bibliografische Details

• Titel: Advances in Thermal Modeling of Electronic Components and Systems, Vol. 2
• Verlag: American Society of Mechanical Engineers, New York
• Erscheinungsjahr: 1990
• Sprache: Englisch
• ISBN-10: 0791800156
• ISBN-13: 9780791800157
• Einband: Hardcover
• Zustand: with no dust jacket
• Zustand des Schutzumschlags: No Dust Jacket

Über diesen Titel

Inhaltsangabe

The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.