Analysis, Architectures and Modelling of Embedded Systems

Rettberg, Achim

ISBN 10: 364204283X / ISBN 13: 9783642042836

Verlag: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, 2009

Series: IFIP Advances in Information and Communication Technology. Num Pages: 326 pages, 165 black & white illustrations, biography. BIC Classification: UGC; UMZ; UT; UYD; UYQE; UYZG. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 19. Weight in Grams: 654. . 2009. Hardback. . . . . Bestandsnummer des Verkäufers V9783642042836

Inhaltsangabe:

This book presents the technical program of the International Embedded Systems Symposium (IESS) 2009. Timely topics, techniques and trends in embedded system design are covered by the chapters in this volume, including modelling, simulation, verification, test, scheduling, platforms and processors. Particular emphasis is paid to automotive systems and wireless sensor networks. Sets of actual case studies in the area of embedded system design are also included. Over recent years, embedded systems have gained an enormous amount of proce- ing power and functionality and now enter numerous application areas, due to the fact that many of the formerly external components can now be integrated into a single System-on-Chip. This tendency has resulted in a dramatic reduction in the size and cost of embedded systems. As a unique technology, the design of embedded systems is an essential element of many innovations. Embedded systems meet their performance goals, including real-time constraints, through a combination of special-purpose hardware and software components tailored to the system requirements. Both the development of new features and the reuse of existing intellectual property components are essential to keeping up with ever more demanding customer requirements. Furthermore, design complexities are steadily growing with an increasing number of components that have to cooperate properly. Embedded system designers have to cope with multiple goals and constraints simul- neously, including timing, power, reliability, dependability, maintenance, packaging and, last but not least, price.

Von der hinteren Coverseite:

This book constitutes the refereed proceedings of the third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, held in Langenargen, Germany, in September 2009.

The 28 revised papers were selected from 46 submissions. The papers are organized in topical sections on modelling; transaction level modelling; scheduling and real-time systems; simulation, verification and test; platforms and processors; automotive systems; and wireless sensor networks. The volume also includes three case studies and two tutorials.

Bibliografische Details

Titel: Analysis, Architectures and Modelling of ...
Verlag: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Erscheinungsdatum: 2009
Einband: Hardcover
Zustand: New