Electronic Packaging Materials and Their Properties

Pecht, Michael; Agarwal, Rakish; McCluskey, F. Patrick; Dishongh, Terrance J.; Javadpour, Sirus; Mahajan, Rahul

ISBN 10: 0849396255 / ISBN 13: 9780849396250

Verlag: CRC Press, 1998

In. Bestandsnummer des Verkäufers ria9780849396250_new

Inhaltsangabe:

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

interconnections

printed circuit boards

substrates

encapsulants

dielectrics

die attach materials

electrical contacts

thermal materials

solders
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Über die Autorin bzw. den Autor: Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

Bibliografische Details

Titel: Electronic Packaging Materials and Their ...
Verlag: CRC Press
Erscheinungsdatum: 1998
Einband: Hardcover
Zustand: New