Electronic Packaging Microelectronics, and Interconnection Dictionary

Harper, Charles A., Miller, Martin B.

ISBN 10: 0070266883 / ISBN 13: 9780070266889

Verlag: McGraw-Hill Education, 1993

Beschreibung

Used book that is in clean, average condition without any missing pages.

Bestandsnummer des Verkäufers 50274982-6

Bibliografische Details

• Titel: Electronic Packaging Microelectronics, and Interconnection Dictionary
• Verlag: McGraw-Hill Education
• Erscheinungsjahr: 1993
• Sprache: Englisch
• ISBN-10: 0070266883
• ISBN-13: 9780070266889
• Einband: Hardcover
• Zustand: Good

Über diesen Titel

Inhaltsangabe

A dictionary focusing on the multidisciplinary field of electronic packaging, this work features an extensive collection of terms and acronyms that comprise the language of modern electronics. From circuits and communication systems to all types of electronic subsystems and assemblies, this reference includes up-to-date entries and clear, concise definitions for more than 6000 terms, acronyms, abbreviations and symbols that are commonly encountered by everyone working in the industry - regardless of their area of expertise. The "Dictionary" covers the full range of high-performance electronic systems, including microelectronics, electronic packaging, materials, components, and much more. Rapidly changing technology and the need for communication in a highly multidisciplinary field make the "Electronic Packaging, Microelectronics and Interconnection Dictionary" a valuable desk reference for electronics, electrical, mechanical and materials engineers, as well as everyone else working in the electronic packaging field.

Über die Autorin bzw. den Autor

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.