Fundamentals of Microsystems Packaging

Tummala, Rao

ISBN 10: 0071371699 / ISBN 13: 9780071371698

Verlag: McGraw-Hill Education, 2001

Beschreibung

Bestandsnummer des Verkäufers 57G50_58_0071371699

Bibliografische Details

• Titel: Fundamentals of Microsystems Packaging
• Verlag: McGraw-Hill Education
• Erscheinungsjahr: 2001
• Sprache: Englisch
• ISBN-10: 0071371699
• ISBN-13: 9780071371698
• Einband: Hardcover
• Zustand: new

Über diesen Titel

Inhaltsangabe

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A rigorous and thorough introduction to electronic packaging technologies

The only book to teach microsystems packaging--written by the field's leading authorThis is the book that engineers, technicians, and students want―the first to teach microsystems packaging from the ground up. Rao Tummala’s one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It’s the only book to do so. This much-needed tool features:

*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.
*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies―wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing
*Hundreds of explanatory two-color illustrations
*Self-test problems and solutions in every chapter
*Glossary
*The best way to learn microsystems packaging through self-study or in a classroom―and the most comprehensive on-the-job reference

MICROSystems PACKAGINGFROM THE GROUND UP

Über die Autorin bzw. den Autor

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.