Mechanical Aspects in Electronics Systems Design

Sprache: Englisch

Verlag: GRIN Verlag Aug 2014, 2014

3656730903 / 9783656730903

Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, DeutschlandBuchWeltWeit Ludwig Meier e.K.

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This item is printed on demand - it takes 3-4 days longer - Neuware -Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described.Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail.Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail. 36 pp. Englisch.

Bestandsnummer des Verkäufers 9783656730903

Titel
Mechanical Aspects in Electronics Systems Design
Autor
Vinay Divakar
Verlag
GRIN Verlag Aug 2014
Veröffentlichungsjahr
2014
Zustand
Neu
Einband
Taschenbuch
Sprache
Englisch
ISBN-10
3656730903
ISBN-13
9783656730903
Artikelgewicht
68 Gramm
Abmessungen
210x148x4 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Deutschland

Verkäufer/-in mit 5 Sternen

AbeBooks-Verkäufer/-in seit 11. Januar 2012

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