Plasma-based technology and materials processes have been central to the revolution of the last half-century in micro- and nano-electronics. From anisotropic plasma etching on microprocessors, memory, and analog chips, to plasma deposition for creating solar panels and flat-panel displays, plasma-based materials processes have reached huge areas of technology. As key technologies scale down in size from the nano- to the atomic level, further developments in plasma materials processing will only become more essential.

Principles of Plasma Discharges and Materials Processing is the foundational introduction to the subject. It offers detailed information and procedures for designing plasma-based equipment and analyzing plasma-based processes, with an emphasis on the abiding fundamentals. Now fully updated to reflect the latest research and data, it promises to continue as an indispensable resource for graduate students and industry professionals in a myriad of technological fields.

Readers of the third edition of Principles of Plasma Discharges and Materials Processing will also find:

Extensive figures and tables to facilitate understanding
A new chapter covering the recent development of processes involving high-pressure capacitive discharges
New subsections on discharge and processing chemistry, physics, and diagnostics

Principles of Plasma Discharges and Materials Processing is ideal for professionals and process engineers in the field of plasma-assisted materials processing with experience in the field of science or engineering. It is the premiere world-wide basic text for graduate courses in the field.

�ber die Autorin bzw. den Autor

Michael A. Lieberman, PhD, is Professor of the Graduate School, Department of Electrical Engineering and Computer Sciences, University of California, Berkeley.

Allan J. Lichtenberg, PhD, was Emeritus Professor of the Department of Electrical Engineering and Computer Sciences, University of California, Berkeley.

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