RF and Microwave Microelectronics Packaging

Ken Kuang

ISBN 10: 1441909834 / ISBN 13: 9781441909831

Verlag: SPRINGER US Nov 2009, 2009

Beschreibung

This item is printed on demand - it takes 3-4 days longer - Neuware -RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. 285 pp. Englisch.

Bestandsnummer des Verkäufers 9781441909831

Bibliografische Details

• Titel: RF and Microwave Microelectronics Packaging
• Verlag: SPRINGER US Nov 2009
• Erscheinungsjahr: 2009
• Sprache: Englisch
• ISBN-10: 1441909834
• ISBN-13: 9781441909831
• Einband: Buch
• Zustand: Neu
• Abmessungen: 243B x 164 H x 34 T Millimeter Breite: 243 mm, Höhe: 164 mm, Tiefe: 34 mm
• Gewicht: 635 Gramm

Über diesen Titel

Inhaltsangabe

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Von der hinteren Coverseite

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also:

• Presents methods and techniques used for measuring and testing of the electronic materials properties.
• Engages in an in-depth discussion of ceramic materials for RF/MW packaging.
• Offers numerical simulation methods and techniques used in analysis of electronic devices and materials.
• Discusses thermal management issues for RF/MW packaging.
• Creates a RF/Microwave Packaging Roadmap for Portable Devices.