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Titel: Simulation Of Semiconductor Processes And ...
Verlag: Springer
Erscheinungsdatum: 2007
Einband: Hardcover
Zustand: New
Anbieter: Books in my Basket, New Delhi, Indien
Hardcover. Zustand: New. ISBN: 9783211728604. Bestandsnummer des Verkäufers 1507250
Anzahl: 1 verfügbar
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 480 | Sprache: Englisch | Produktart: Bücher | The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites. Bestandsnummer des Verkäufers 3662543/12
Anzahl: 1 verfügbar
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 480 | Sprache: Englisch | Produktart: Bücher | The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites. Bestandsnummer des Verkäufers 3662543/2
Anzahl: 1 verfügbar
Anbieter: ALLBOOKS1, Direk, SA, Australien
Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address. Bestandsnummer des Verkäufers SHAK236442
Anzahl: 1 verfügbar
Anbieter: ALLBOOKS1, Direk, SA, Australien
Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address. Bestandsnummer des Verkäufers SHAK236441
Anzahl: 1 verfügbar
Anbieter: Basi6 International, Irving, TX, USA
Zustand: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. Bestandsnummer des Verkäufers ABEOCT25-236443
Anbieter: ALLBOOKS1, Direk, SA, Australien
Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address. Bestandsnummer des Verkäufers SHAK236443
Anzahl: 1 verfügbar
Anbieter: ALLBOOKS1, Direk, SA, Australien
Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address. Bestandsnummer des Verkäufers SHAK236444
Anzahl: 1 verfügbar
Anbieter: preigu, Osnabrück, Deutschland
Taschenbuch. Zustand: Neu. Simulation of Semiconductor Processes and Devices 2007 | SISPAD 2007 | Siegfried Selberherr (u. a.) | Taschenbuch | xv | Englisch | 2017 | Springer | EAN 9783709119112 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. Bestandsnummer des Verkäufers 109009309
Anzahl: 5 verfügbar
Anbieter: Lucky's Textbooks, Dallas, TX, USA
Zustand: New. Bestandsnummer des Verkäufers ABLIING23Mar3113020323593
Anzahl: Mehr als 20 verfügbar