System Verilog Assertions and Functional Coverage
Mehta
Verkauft von Lucky's Textbooks, Dallas, TX, USA
AbeBooks-Verkäufer seit 22. Juli 2022
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In den Warenkorb legenVerkauft von Lucky's Textbooks, Dallas, TX, USA
AbeBooks-Verkäufer seit 22. Juli 2022
Zustand: Neu
Anzahl: Mehr als 20 verfügbar
In den Warenkorb legenBestandsnummer des Verkäufers ABLIING23Mar3113020011054
This updated third edition addresses the latest functional set released in IEEE-1800 (2012) LRM, including numerous additional operators and features. Additionally, many of the Concurrent Assertions/Operators explanations are enhanced, with the addition of more examples and figures.
· Covers in its entirety the latest IEEE-1800 2012 LRM syntax and semantics;
· Covers both SystemVerilog Assertions and SystemVerilog Functional Coverage languages and methodologies;
· Provides practical applications of the what, how and why of Assertion Based Verification and Functional Coverage methodologies;
· Explains each concept in a step-by-step fashion and applies it to a practical real life example;· Includes 6 practical LABs that enable readers to put in practice the concepts explained in the book.
Ashok Mehta has been working in the ASIC/SoC design and verification field for over 20 years. He started his career at Digital Equipment Corporation (DEC) working as a CPU design engineer. He then worked at Data General, Intel (first Pentium design team) and after a route of a couple of startups, worked at Applied Micro and TSMC. He was a very early adopter of Verilog and participated in Verilog, VHDL, iHDL (Intel HDL) and SDF (standard delay format) technical subcommittees. He has also been a proponent of ESL (Electronic System Level) designs and at TSMC he released two industry standard Reference Flows that establish Reuse of Verification Environment from ESL to RTL. Lately, he has been researching 3DIC design verification challenges at TSMC which is where SystemVerilog Assertions played an instrumental role in stacked die SoC design verification.
Ashok earned an MSEE from University of Missouri. He holds 18 U.S. Patents in the field of SoC and 3DIC design verification.„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
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