Inhaltsangabe:
Joshi (mechanical engineering, Georgia Institute of Technology) and Garimella (mechanical engineering, Purdue U.) present 44 papers from the January 2002 conference that explore issues of thermal management in electronic products of a range of sizes, although the progression of shrinking system sizes is of particular concern. After the nine keynote and invited lectures, the papers are organized under the following categories: challenges in micro- and nano-scale transport, novel thermal management concepts, high heat flux transport, transport in thermal management materials and across interfaces, heat pipes and thermosyphons, compact models, design methodologies, and analysis and testing methods. The text does not note what the CD-ROM contains. Annotation (c) Book News, Inc., Portland, OR (booknews.com)
Reseña del editor:
Joshi (mechanical engineering, Georgia Institute of Technology) and Garimella (mechanical engineering, Purdue U.) present 44 papers from the January 2002 conference that explore issues of thermal management in electronic products of a range of sizes, although the progression of shrinking system sizes is of particular concern. After the nine keynote and invited lectures, the papers are organized under the following categories: challenges in micro- and nano-scale transport, novel thermal management concepts, high heat flux transport, transport in thermal management materials and across interfaces, heat pipes and thermosyphons, compact models, design methodologies, and analysis and testing methods. The text does not note what the CD-ROM contains. Annotation (c) Book News, Inc., Portland, OR (booknews.com)
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