Ultraclean Surface Processing of Silicon Wafers : Secrets of VLSI Manufacturing

Takeshi Hattori

ISBN 10: 3540616721 / ISBN 13: 9783540616726

Verlag: Springer, Berlin, Springer Berlin Heidelberg, Springer, 1998

Beschreibung

Druck auf Anfrage Neuware - Printed after ordering - A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved inthe production of silicon semiconductor devices.

Bestandsnummer des Verkäufers 9783540616726

Bibliografische Details

• Titel: Ultraclean Surface Processing of Silicon Wafers : Secrets of VLSI Manufacturing
• Verlag: Springer, Berlin, Springer Berlin Heidelberg, Springer
• Erscheinungsjahr: 1998
• Sprache: Englisch
• ISBN-10: 3540616721
• ISBN-13: 9783540616726
• Einband: Buch
• Zustand: Neu
• Abmessungen: 238B x 153 H x 44 T Millimeter Breite: 238 mm, Höhe: 153 mm, Tiefe: 44 mm
• Gewicht: 890 Gramm

Über diesen Titel

Inhaltsangabe

A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.

Von der hinteren Coverseite

The contamination of wafer surfaces with particles arising from the processing equipment is the main reason for yield losses in the manufacturing of VLSI devices. The starting point for the control of contamination must be the surface of the wafer itself and not just the reduction of contamination in the ambient air or in the gases, chemicals and water used for production. A totally new concept for clean surface processing is introduced here. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic, as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.