Sprache: Deutsch
Verlag: Verlag Technische Rundschau im Hallwag-Verlag, Bern, 1979
4°, Broschur. Zustand: Sehr gut. 146 Seiten, 3 Bl. Ausgetragenes Bibliotheksexemplar, Buch ist in einem sehr guten Zustand. Einband leicht berieben, Ecken und Kanten leicht berieben, Papier in sehr gutem Zustand. B03-04-02H Sprache: Deutsch Gewicht in Gramm: 470.
Anbieter: GreatBookPrices, Columbia, MD, USA
EUR 104,79
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 93,46
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: GreatBookPrices, Columbia, MD, USA
EUR 106,80
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: As New. Unread book in perfect condition.
Anbieter: GreatBookPrices, Columbia, MD, USA
EUR 108,19
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New.
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
EUR 93,45
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 99,52
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
EUR 97,20
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New.
Anbieter: BennettBooksLtd, Los Angeles, CA, USA
hardcover. Zustand: New. In shrink wrap. Looks like an interesting title!
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
EUR 107,38
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: As New. Unread book in perfect condition.
Sprache: Englisch
Verlag: John Wiley and Sons Inc, US, 2011
ISBN 10: 0470748249 ISBN 13: 9780470748244
Anbieter: Rarewaves.com USA, London, LONDO, Vereinigtes Königreich
EUR 128,47
Anzahl: Mehr als 20 verfügbar
In den WarenkorbHardback. Zustand: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Anbieter: BOOKWEST, Phoenix, AZ, USA
Hardcover. Zustand: New. SHRINK-WRAPPED: US SELLER SHIPS FROM USA.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 115,41
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: Chiron Media, Wallingford, Vereinigtes Königreich
EUR 113,26
Anzahl: 10 verfügbar
In den WarenkorbPF. Zustand: New.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 127,20
Anzahl: 3 verfügbar
In den WarenkorbZustand: New. pp. xxii + 317 Illus.
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 509 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 131,62
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 509 pages. 9.50x6.25x1.25 inches. In Stock.
Anbieter: Books Puddle, New York, NY, USA
Zustand: New. pp. xxii + 317.
EUR 98,79
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. The objective of this book is to better understand why components fail, addressing the needs of engineers who will apply reliability principles in design, manufacture, testing, and field service. It so contributes to new approaches and the development of el.
Anbieter: Mispah books, Redhill, SURRE, Vereinigtes Königreich
EUR 144,14
Anzahl: 1 verfügbar
In den WarenkorbHardcover. Zustand: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Zustand: New. pp. 558.
Anbieter: ECOSPHERE, Champs sur marne, Frankreich
Erstausgabe
Couverture rigide. Zustand: Neuf. Edition originale.
Anbieter: Antiquariat ARS LIBRI, Andreas Lutz, Windeck, Deutschland
Signiert
Berlin, VDE Verlag 1985. 448 Seiten m. zahlreichen Abbildungen. Orig. Softcover, 8°. Gut erhalten. Mit Widmung des Verfassers verso Titelblatt.
Anbieter: preigu, Osnabrück, Deutschland
Taschenbuch. Zustand: Neu. Reliability of Electronic Components | A Practical Guide to Electronic Systems Manufacturing | Titu I. Bajenescu (u. a.) | Taschenbuch | xli | Englisch | 2012 | Springer | EAN 9783642636257 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 175,43
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 1st edition. 344 pages. 10.00x6.00x0.75 inches. In Stock.
Sprache: Englisch
Verlag: John Wiley and Sons Inc, US, 2011
ISBN 10: 0470748249 ISBN 13: 9780470748244
Anbieter: Rarewaves.com UK, London, Vereinigtes Königreich
EUR 121,24
Anzahl: Mehr als 20 verfügbar
In den WarenkorbHardback. Zustand: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Anbieter: Mispah books, Redhill, SURRE, Vereinigtes Königreich
EUR 195,37
Anzahl: 1 verfügbar
In den WarenkorbPaperback. Zustand: Like New. Like New. book.
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
EUR 316,86
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: As New. Unread book in perfect condition.
Anbieter: Mispah books, Redhill, SURRE, Vereinigtes Königreich
EUR 307,35
Anzahl: 1 verfügbar
In den WarenkorbHardcover. Zustand: Like New. Like New. book.
Anbieter: GreatBookPrices, Columbia, MD, USA
EUR 344,00
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: As New. Unread book in perfect condition.