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Sprache: Englisch
Verlag: Springer, 2012
Serie: Computational Microelectronics, Buch 1 von 17. Buch 1 von 17 - Computational Microelectronics
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Verlag: Springer, 2012
Serie: Computational Microelectronics, Buch 1 von 17. Buch 1 von 17 - Computational Microelectronics
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Sprache: Englisch
Verlag: Springer Vienna, 2013
Serie: Computational Microelectronics, Buch 1 von 17. Buch 1 von 17 - Computational Microelectronics
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Paperback. Zustand: Brand New. 324 pages. 9.61x6.69x0.68 inches. In Stock.
Sprache: Englisch
Verlag: Springer Vienna, 2012
Serie: Computational Microelectronics, Buch 1 von 17. Buch 1 von 17 - Computational Microelectronics
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Weitere BilderSprache: Englisch
Verlag: Springer, 2012
Serie: Computational Microelectronics, Buch 1 von 17. Buch 1 von 17 - Computational Microelectronics
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Taschenbuch. Zustand: Neu. Technology CAD Systems | Franz Fasching (u. a.) | Taschenbuch | viii | Englisch | 2012 | Springer | EAN 9783709193174 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Sprache: Englisch
Verlag: Springer, 2012
Serie: Computational Microelectronics, Buch 1 von 17. Buch 1 von 17 - Computational Microelectronics
- Softcover
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's busin…ess. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
Sprache: Englisch
Verlag: Springer, 2012
Serie: Computational Microelectronics, Buch 1 von 17. Buch 1 von 17 - Computational Microelectronics
- Softcover
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Paperback. Zustand: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Sprache: Englisch
Verlag: Springer, 2012
Serie: Computational Microelectronics, Buch 1 von 17. Buch 1 von 17 - Computational Microelectronics
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Sprache: Englisch
Verlag: Springer Vienna Jan 2012, 2012
Serie: Computational Microelectronics, Buch 1 von 17. Buch 1 von 17 - Computational Microelectronics
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Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete…in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools. 324 pp. Englisch.
Sprache: Englisch
Verlag: Springer, 2012
Serie: Computational Microelectronics, Buch 1 von 17. Buch 1 von 17 - Computational Microelectronics
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Zustand: New. Print on Demand pp. 324 199 Figures, 67:B&W 6.69 x 9.61 in or 244 x 170 mm (Pinched Crown) Perfect Bound on White w/Gloss Lam.
Sprache: Englisch
Verlag: Springer, 2012
Serie: Computational Microelectronics, Buch 1 von 17. Buch 1 von 17 - Computational Microelectronics
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Zustand: New. PRINT ON DEMAND pp. 324.
Sprache: Englisch
Verlag: Springer Vienna, Springer Jan 2012, 2012
Serie: Computational Microelectronics, Buch 1 von 17. Buch 1 von 17 - Computational Microelectronics
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Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in t…oday's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 324 pp. Englisch.
