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Kluwer, Boston, 1995. XXII, 280 pages with some graphics, hardcover----former library book in good condition- 536 Gramm.
Verlag: Springer, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
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Hardcover. Zustand: Like New. Pristine. Fine in every way. Looks unread.
Verlag: Springer, 1995
ISBN 10: 0792395441ISBN 13: 9780792395447
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Hardcover. Zustand: Bon. Ancien livre de bibliothèque. Légères traces d'usure sur la couverture. Edition 1995. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Good. Former library book. Slight signs of wear on the cover. Edition 1995. Ammareal gives back up to 15% of this item's net price to charity organizations.
Verlag: Springer, 2012
ISBN 10: 1461359422ISBN 13: 9781461359425
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Paperback. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 0.96.
Verlag: Springer US, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
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Zustand: Gut. Zustand: Gut - Gebrauchs- und Lagerspuren. Außen: verschmutzt, angestoßen. Innen: Seiten eingerissen, Seiten verschmutzt, Geknickt. | Seiten: 308 | Sprache: Englisch.
Verlag: Springer, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
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Zustand: New. New. In shrink wrap. Looks like an interesting title! 1.28.
Verlag: Springer, 2012
ISBN 10: 1461359422ISBN 13: 9781461359425
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Zustand: New.
Verlag: Springer, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
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Zustand: New.
Verlag: Springer, 2012
ISBN 10: 1461359422ISBN 13: 9781461359425
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Soft Cover. Zustand: new.
Verlag: Springer, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
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Buch
Hardcover. Zustand: new.
Verlag: Springer US, 2012
ISBN 10: 1461359422ISBN 13: 9781461359425
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Buch
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign ers who have to deal with the complexityofmixed-signal coupling is the lackofveri fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions.
Verlag: Springer US Okt 2012, 2012
ISBN 10: 1461359422ISBN 13: 9781461359425
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Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign ers who have to deal with the complexityofmixed-signal coupling is the lackofveri fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. 308 pp. Englisch.
Verlag: Springer, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
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Zustand: New.
Verlag: Springer, 2012
ISBN 10: 1461359422ISBN 13: 9781461359425
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ISBN 10: 1461359422ISBN 13: 9781461359425
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Verlag: Springer, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
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ISBN 10: 1461359422ISBN 13: 9781461359425
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Zustand: New.
Verlag: Springer US Dez 1994, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
Buch Print-on-Demand
Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign ers who have to deal with the complexityofmixed-signal coupling is the lackofveri fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. 308 pp. Englisch.
Verlag: Springer-Verlag New York Inc., 2012
ISBN 10: 1461359422ISBN 13: 9781461359425
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Buch Print-on-Demand
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Verlag: Springer US, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
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Buch Print-on-Demand
Gebunden. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. List of Figures. List of Tables. Preface. 1. Introduction. 2. Sources of Noise and Methods of Coupling. 3. Semiconductor Device Simulation. 4. Simplified Substrate Modeling and Rapid Simulation. 5. Mesh Generation. 6. Substrate Modeling in Heavily-Doped.
Verlag: Springer US, 2012
ISBN 10: 1461359422ISBN 13: 9781461359425
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Buch Print-on-Demand
Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. List of Figures. List of Tables. Preface. 1. Introduction. 2. Sources of Noise and Methods of Coupling. 3. Semiconductor Device Simulation. 4. Simplified Substrate Modeling and Rapid Simulation. 5. Mesh Generation. 6. Substrate Modeling in Heavily-Doped.
Verlag: Springer, 2012
ISBN 10: 1461359422ISBN 13: 9781461359425
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Zustand: New. pp. 308 Index.
Verlag: Springer US, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign ers who have to deal with the complexityofmixed-signal coupling is the lackofveri fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions.
Verlag: Springer, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
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Zustand: New.
Verlag: Kluwer Academic Pub, 1995
ISBN 10: 0792395441ISBN 13: 9780792395447
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Hardcover. Zustand: Brand New. 1995 edition. 304 pages. 9.75x6.50x0.75 inches. In Stock.
Verlag: Springer, 2012
ISBN 10: 1461359422ISBN 13: 9781461359425
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Zustand: New. Print on Demand pp. 308 Figures, 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Verlag: Springer-Verlag New York Inc., 2012
ISBN 10: 1461359422ISBN 13: 9781461359425
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Zustand: New. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 280 pages, biography. BIC Classification: THR; TJFC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 17. Weight in Grams: 474. . 2012. Softcover reprint of the original 1st ed. 1995. Paperback. . . . .
Verlag: Kluwer Academic Publishers, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
Anbieter: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irland
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Zustand: New. This text addresses two major issues of the mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques and suggests possible solutions. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 280 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 22. Weight in Grams: 625. . 1994. Hardback. . . . .
Verlag: Springer, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
Anbieter: GreatBookPricesUK, Castle Donington, DERBY, Vereinigtes Königreich
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Zustand: As New. Unread book in perfect condition.
Verlag: Springer, 1994
ISBN 10: 0792395441ISBN 13: 9780792395447
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Hardcover. Zustand: Like New. Like New. book.