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pecht michael (585 Ergebnisse)
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Verkäuferbewertung
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paperback. Zustand: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Semiconductor Packaging: A Multidisciplinary Approach
Anbieter: ThriftBooks-Dallas, Dallas, TX, USA
Verkäuferbewertung 5 von 5 Sternen
Paperback. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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Hardcover. Zustand: Fair. No Jacket. 1st Edition. This book is seriously flawed by the fact that pages 289 to 307 function as an insert. They are completely separated from the binding. But the book is all there and is otherwise in new condition. There are no tears or signs of wear to the clean pages or the cover.
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Product Reliability, Maintainability, and Supportability Handbook
Anbieter: Crossroad Books, Eau Claire, WI, USA
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: with no dust jacket. Zustand des Schutzumschlags: No Dust Jacket. Ex-Corporate Library copy; with typical markings. Library label on front board and on spine tail. Slight spine twist. Pages clean, but for library markings. ; TEH22B; 413 pages; Ex-Library.
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hardcover. Zustand: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Zustand: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item for full refund. Ships USPS Media Mail.
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Zustand: New. pp. 128 1st Edition.
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Plastic-Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications
Anbieter: Florida Mountain Book Co., Datil, NM, USA
Verkäuferbewertung 5 von 5 Sternen
Zustand: Very Good. Hardcover, [xxxiv], 474 pages. Very Good condition/no dust jacket. Ex-library. Size 9.5"x6.5". "For the first time between two covers, here is a comprehensive, critical review of the state of the art in PEMs and assemblies that incorporate them. The most timely book on the subject, it provides professionals with a systematic, scientific exploration of crucial technical and reliability issues concerning the manufacture and use of PEMs - with special attention focusing on environment-specific applications." Library stamp on front pastedown & title page, previous owner's name on front & rear pastedowns, else Near Fine condition, clean and unmarked.
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Guidebook for Managing Silicon Chip Reliability (Electronic Packaging Series)
Buch 2 von 4: Electronic PackagingAnbieter: Goodwill of Silicon Valley, SAN JOSE, CA, USA
Verkäuferbewertung 4 von 5 Sternen
Zustand: acceptable. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Acceptable condition! Any other included accessories are also in Acceptable condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear such as cover tears discoloration, staining, marks, scuffs, etc. All pages intact.
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Singapore and Malaysia Electronics Industries
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
Verkäuferbewertung 4 von 5 Sternen
EUR 16,83
EUR 7,40 shipping
Versand von Vereinigtes Königreich nach USAAnzahl: 1 verfügbar
In den WarenkorbZustand: New. pp. 128.
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Hardcover. Zustand: Very Good. Zustand des Schutzumschlags: No Dust Jacket. 1st Edition. Name of previous owner in ink inside front board. Otherwise copy is clean and unmarked in very good condition. 214 pages.
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Zustand: New. pp. 144 1st Edition.
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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
Anbieter: ThriftBooks-Dallas, Dallas, TX, USA
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: Very Good. No Jacket. Missing dust jacket; May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 1.75.
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Zustand: New. pp. 176 1st Edition.
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Hardcover. Zustand: Très bon. Ancien livre de bibliothèque. Edition 1996. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Very good. Former library book. Edition 1996. Ammareal gives back up to 15% of this item's net price to charity organizations.
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Singapore and Malaysia Electronics Industries
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Verkäuferbewertung 4 von 5 Sternen
Zustand: New. pp. 128.
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Hardcover. Zustand: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Anbieter: ThriftBooks-Dallas, Dallas, TX, USA
Verkäuferbewertung 5 von 5 Sternen
Paperback. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Anbieter: K & L KICKIN' BOOKS, Corinth, TX, USA
Verkäuferbewertung 4 von 5 Sternen
Erstausgabe
Hardcover. Zustand des Schutzumschlags: no dust jacket. First Edition. Very good with slight shelf wear.
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Plasticâ"Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications
Anbieter: WeBuyBooks, Rossendale, LANCS, Vereinigtes Königreich
Verkäuferbewertung 5 von 5 Sternen
EUR 19,99
EUR 9,91 shipping
Versand von Vereinigtes Königreich nach USAAnzahl: 1 verfügbar
In den WarenkorbZustand: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. Ex library copy with usual stamps & stickers.
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The Korean Electronics Industry
Buch 3 von 3: The Electronics Industry Research SeriesAnbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Verkäuferbewertung 4 von 5 Sternen
Zustand: New. pp. 144.
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Electronics Industry in Taiwan
Buch 2 von 3: The Electronics Industry Research SeriesAnbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Verkäuferbewertung 4 von 5 Sternen
Zustand: New. pp. 176.
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Guidebook for Managing Silicon Chip Reliability. (=Electronic Packaging Series).
Sprache: Englisch
Verlag: Taylor & Francis Inc., 1998
Anbieter: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Deutschland
Verbandsmitglied: GIAQ
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: Wie neu. 224 S.; Ill. Like new. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 655.
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Fröhliche Weihnacht überall - Die schönsten Weihnachtslieder mit Noten
Anbieter: Antiquariat Fuchseck, Gammelshausen, Deutschland
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: Gut. Angelika Pecht: (illustrator). o.J. (22 Seiten).
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Risk-Based Engineering: An Integrated Approach to Complex Systems?Special Reference to Nuclear Plants (Springer Series in Reliability Engineering)
Buch 60 von 90: Springer Series in Reliability EngineeringAnbieter: Twice Sold Tales, Seattle, WA, USA
Verkäuferbewertung 1 von 5 Sternen
Hardcover. Zustand: Good. The book is in good condition with a clean interior; the cover contain minor bumps and scratches along the spine and edges. Book.
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Placement and Routing of Electronic Modules (Electrical and Computer Engineering)
Buch 46 von 55: Electrical and Computer EngineeringAnbieter: World of Books (was SecondSale), Montgomery, IL, USA
Verkäuferbewertung 5 von 5 Sternen
Zustand: Good. Item in good condition. Textbooks may not include supplemental items i.e. CDs, access codes etc.
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Influence of Temperature on Microelectronics and System Reliability : A Physics of Failure Approach (Electronic Packaging Series)
Buch 4 von 4: Electronic PackagingSprache: Englisch
Verlag: CRC Press, Boca Raton, FL, 1997
ISBN 10: 0849394503 ISBN 13: 9780849394508
Anbieter: Dorley House Books, Inc., Hagerstown, MD, USA
Verkäuferbewertung 4 von 5 Sternen
Erstausgabe
Hardcover. Zustand: Near Fine. B/W Photos; Diagrams, Etc (illustrator). 1st. 1st printing; glossy pictorial c; 307 clean, unmarked pages.
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The Korean Electronics Industry
Buch 3 von 3: The Electronics Industry Research SeriesAnbieter: Greenworld Books, Arlington, TX, USA
Verkäuferbewertung 5 von 5 Sternen
Zustand: good. Fast Free Shipping â" Good condition book with a firm cover and clean, readable pages. Shows normal use, including some light wear or limited notes highlighting, yet remains a dependable copy overall. Supplemental items like CDs or access codes may not be included.
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Hardcover. Zustand: Acceptable. Connecting readers with great books since 1972. Used textbooks may not include companion materials such as access codes, etc. May have condition issues including wear and notes/highlighting. We ship orders daily and Customer Service is our top priority!
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Hardcover. Zustand: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
