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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book constitutes the proceedings of the 21st International Symposium on Applied Reconfigurable Computing. Architectures, Tools, and Applications, ARC 2025, held in Seville, Spain, during April 9 11, 2025. The 12 full papers presented in this book together with 1 short paper from the technical program were carefully reviewed and selected from 40 submissions.ARC 2025 covers a wide range of topics, including hardware acceleration, security and fault tolerance, energy-efficient architectures, and emerging applications in artificial intelligence and high-performance computing. The symposium fostered collaboration and pushed the boundaries of state-of-the-art research.…

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Taschenbuch. Zustand: Neu. Applied Reconfigurable Computing. Architectures, Tools, and Applications | 21st International Symposium, ARC 2025, Seville, Spain, April 9-11, 2025, Proceedings | Roberto Giorgi (u. a.) | Taschenbuch | Lecture Notes in Computer Science | xiv | Englisch | 2025 | Springer | EAN 9783031879944 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI technology. With gigahertz system clocks and ever accelerating design and process innovations, interconnects have become the limiting factor for both performance and density. This increasing impact of interconnects on the system implementation space necessitates new tools and analytic techniques to support the system designer. With respect to modeling and analysis, the response to interconnect dom inance is evolutionary. Atomistic- and grain-level models of interconnect structure, and performance models at multi-gigahertz operating frequencies, together guide the selection of improved materials and process technologies (e. g. , damascene copper wires, low-permittivity dielectrics). Previously in significant effects (e. g. , mutual inductance) are added into performance mod els, as older approximations (e. g. , lumped-capacitance gate load models) are discarded. However, at the system-level and chip planning level, the necessary response to interconnect dominance is revolutionary. Convergent design flows do not require only distributed RLC line models, repeater awareness, unifi cations with extraction and analysis, etc. Rather, issues such as wiring layer assignment, and early prediction of the resource and performance envelope for the system interconnect (in particular, based on statistical models of the system interconnect structure), also become critical. Indeed, system-level interconnect prediction has emerged as the enabler of improved interconnect modeling, more cost-effective system architectures, and more productive design technology.…

Zustand: New. The design of digital (computer) systems requires several design phases. This book aims to develop a priori wire length estimation methods that can help the designer in finding a good lay-out of a circuit in less iterations of physical design steps and that are useful to compare different physical architectures. Num Pages: 298 pages, biography. BIC Classification: TBD; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 19. Weight in Grams: 636. . 2001. Hardback. . . . .…

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Zustand: New. The design of digital (computer) systems requires several design phases. This book aims to develop a priori wire length estimation methods that can help the designer in finding a good lay-out of a circuit in less iterations of physical design steps and that are useful to compare different physical architectures. Num Pages: 298 pages, biography. BIC Classification: TBD; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 19. Weight in Grams: 636. . 2001. Hardback. . . . . Books ship from the US and Ireland.…

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Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book constitutes the proceedings of the 21st International Symposium on Applied Reconfigurable Computing. Architectures, Tools, and Applications, ARC 2025, held in Seville, Spain, during April 9 11, 2025. The 12 full papers presented in this book together with 1 short paper from the technical program were carefully reviewed and selected from 40 submissions.ARC 2025 covers a wide range of topics, including hardware acceleration, security and fault tolerance, energy-efficient architectures, and emerging applications in artificial intelligence and high-performance computing. The symposium fostered collaboration and pushed the boundaries of state-of-the-art research. 260 pp. Englisch. …

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Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book constitutes the proceedings of the 21st International Symposium on Applied Reconfigurable Computing. Architectures, Tools, and Applications, ARC 2025, held in Seville, Spain, during April 911, 2025.The 12 full papers presented in this book together with 1 short paper from the technical program were carefully reviewed and selected from 40 submissions.ARC 2025 covers a wide range of topics, including hardware acceleration, security and fault tolerance, energy-efficient architectures, and emerging applications in artificial intelligence and high-performance computing. The symposium fostered collaboration and pushed the boundaries of state-of-the-art research.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 260 pp. Englisch. …

Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI technology. With gigahertz system clocks and ever accelerating design and process innovations, interconnects have become the limiting factor for both performance and density. This increasing impact of interconnects on the system implementation space necessitates new tools and analytic techniques to support the system designer. With respect to modeling and analysis, the response to interconnect dom inance is evolutionary. Atomistic- and grain-level models of interconnect structure, and performance models at multi-gigahertz operating frequencies, together guide the selection of improved materials and process technologies (e. g. , damascene copper wires, low-permittivity dielectrics). Previously in significant effects (e. g. , mutual inductance) are added into performance mod els, as older approximations (e. g. , lumped-capacitance gate load models) are discarded. However, at the system-level and chip planning level, the necessary response to interconnect dominance is revolutionary. Convergent design flows do not require only distributed RLC line models, repeater awareness, unifi cations with extraction and analysis, etc. Rather, issues such as wiring layer assignment, and early prediction of the resource and performance envelope for the system interconnect (in particular, based on statistical models of the system interconnect structure), also become critical. Indeed, system-level interconnect prediction has emerged as the enabler of improved interconnect modeling, more cost-effective system architectures, and more productive design technology. 328 pp. Englisch. …

Buch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI technology. With gigahertz system clocks and ever accelerating design and process innovations, interconnects have become the limiting factor for both performance and density. This increasing impact of interconnects on the system implementation space necessitates new tools and analytic techniques to support the system designer. With respect to modeling and analysis, the response to interconnect dom inance is evolutionary. Atomistic- and grain-level models of interconnect structure, and performance models at multi-gigahertz operating frequencies, together guide the selection of improved materials and process technologies (e. g. , damascene copper wires, low-permittivity dielectrics). Previously in significant effects (e. g. , mutual inductance) are added into performance mod els, as older approximations (e. g. , lumped-capacitance gate load models) are discarded. However, at the system-level and chip planning level, the necessary response to interconnect dominance is revolutionary. Convergent design flows do not require only distributed RLC line models, repeater awareness, unifi cations with extraction and analysis, etc. Rather, issues such as wiring layer assignment, and early prediction of the resource and performance envelope for the system interconnect (in particular, based on statistical models of the system interconnect structure), also become critical. Indeed, system-level interconnect prediction has emerged as the enabler of improved interconnect modeling, more cost-effective system architectures, and more productive design technology.…

Buch. Zustand: Neu. A Priori Wire Length Estimates for Digital Design | Dirk Stroobandt | Buch | xxii | Englisch | 2001 | Springer US | EAN 9780792373605 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.…

Buch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI technology. With gigahertz system clocks and ever accelerating design and process innovations, interconnects have become the limiting factor for both performance and density. This increasing impact of interconnects on the system implementation space necessitates new tools and analytic techniques to support the system designer. With respect to modeling and analysis, the response to interconnect dom inance is evolutionary. Atomistic- and grain-level models of interconnect structure, and performance models at multi-gigahertz operating frequencies, together guide the selection of improved materials and process technologies (e. g. , damascene copper wires, low-permittivity dielectrics). Previously in significant effects (e. g. , mutual inductance) are added into performance mod els, as older approximations (e. g. , lumped-capacitance gate load models) are discarded. However, at the system-level and chip planning level, the necessary response to interconnect dominance is revolutionary. Convergent design flows do not require only distributed RLC line models, repeater awareness, unifi cations with extraction and analysis, etc. Rather, issues such as wiring layer assignment, and early prediction of the resource and performance envelope for the system interconnect (in particular, based on statistical models of the system interconnect structure), also become critical. Indeed, system-level interconnect prediction has emerged as the enabler of improved interconnect modeling, more cost-effective system architectures, and more productive design technology.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 328 pp. Englisch.…