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Sprache: Englisch
Verlag: William Andrew Publishing, 2016
ISBN 10: 0128103701 ISBN 13: 9780128103708
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EUR 176,30
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In den WarenkorbPaperback / softback. Zustand: New. New copy - Usually dispatched within 4 working days.
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
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In den WarenkorbZustand: New. In.
Anbieter: preigu, Osnabrück, Deutschland
Taschenbuch. Zustand: Neu. Adhesives Technology for Electronic Applications | Materials, Processing, Reliability | James J. Licari (u. a.) | Taschenbuch | Einband - fest (Hardcover) | Englisch | 2016 | William Andrew | EAN 9780128103708 | Verantwortliche Person für die EU: Zeitfracht Medien GmbH, Ferdinand-Jühlke-Str. 7, 99095 Erfurt, produktsicherheit[at]zeitfracht[dot]de | Anbieter: preigu.
Sprache: Englisch
Verlag: William Andrew Publishing, US, 2016
ISBN 10: 0128103701 ISBN 13: 9780128103708
Anbieter: Rarewaves.com USA, London, LONDO, Vereinigtes Königreich
EUR 238,02
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In den WarenkorbPaperback. Zustand: New. Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly 'green' adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devicesBio-compatible adhesives for implantable medical devicesElectrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU's Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market)Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.
EUR 225,59
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In den WarenkorbKartoniert / Broschiert. Zustand: New.
Sprache: Englisch
Verlag: William Andrew Publishing, US, 2016
ISBN 10: 0128103701 ISBN 13: 9780128103708
Anbieter: Rarewaves.com UK, London, Vereinigtes Königreich
EUR 226,40
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In den WarenkorbPaperback. Zustand: New. Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly 'green' adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devicesBio-compatible adhesives for implantable medical devicesElectrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU's Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market)Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.
Anbieter: Brook Bookstore On Demand, Napoli, NA, Italien
EUR 128,31
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In den WarenkorbZustand: new. Questo è un articolo print on demand.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 159,70
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In den WarenkorbPaperback. Zustand: Brand New. 2nd edition. 414 pages. 9.00x6.00x1.00 inches. In Stock. This item is printed on demand.
Sprache: Englisch
Verlag: Elsevier Science & Technology, William Andrew, 2016
ISBN 10: 0128103701 ISBN 13: 9780128103708
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly green adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devicesBio-compatible adhesives for implantable medical devicesElectrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market)Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices. Englisch.
Sprache: Englisch
Verlag: Elsevier Science & Technology, William Andrew, 2016
ISBN 10: 0128103701 ISBN 13: 9780128103708
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly green adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devicesBio-compatible adhesives for implantable medical devicesElectrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market)Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.