Isbn: 9780412105913 - failure modes and mechanisms in electronic packages (12 Ergebnisse)

Hardcover. Zustand: Sehr gut. Gebundene Ausgabe: 370 Seiten sehr gut / fine - nur a-807.

Hardcover. Zustand: As New. 1st Edition. UK stocked, available immediately. Hardcover, published by Chapman & Hall in 1998. A superb copy throughout, in glossy illustrated covers. The contents are unmarked. Illustrated. Weight (unpacked) is 706 grams.

Zustand: New. Well packaged and promptly shipped from California. US veteran operated.

hardcover. Zustand: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority.

Hardcover. Zustand: Near Fine condition. No jacket, as issued. First Edition. New York: Chapman & Hall, 1998. Near Fine condition. Bright, shiny, clean, square, and tight. NO owner's name or bookplate. NOT a remainder. Pages are fresh and crisp -- probably never read. NO underlining. NO highlighting. NO margin notes. Illustrated with diagrams and many photos. Five appendices/Glossary. Index. Bound in the original glossy black laminated boards. First printing with complete number row (123456789 10) on the copyright page. First Edition. Hardcover. Near Fine condition/No jacket, as issued. 8vo. xx, 370pp.…

hardcover. Zustand: New. In shrink wrap. Looks like an interesting title.

Zustand: Good. Good+; Hardcover; Withdrawn library copy with minimal library markings; Light wear to the covers; Library stamps to the endpapers; Text pages are clean & unmarked; Binding is excellent with a straight spine; This book will be stored and delivered in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Black covers with title in yellow lettering; 1997, Springer-Verlag Publishing; 370 pages; "Failure Modes and Mechanisms in Electronic Packages," by P. Singh & Puligandla Viswanadham.…

Zustand: New. In English.

Zustand: New. pp. 396.

Buch. Zustand: Neu. Neuware - Those of us who grew up in the 'through-hole' age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability. My son, an electrical engineering student, seems almost to take for granted the innovations that leave me somewhat awestruck at times. Electronic circuit designers delight in packing more punch into less volume, while reminding us that their job has become increasingly challenging. The lay person also has learned from the media that the industry has been working wonders in shrinking the transistor and expanding the power of 'the chip. ' Much attention is focussed on the silicon and on the marvelous production and entertainment tools we now see in our offices and homes. Between the silicon and the end product lies the less publicized world of circuit-level packaging. We leave it to a cadre of technologists to take the schematics and parts lists and to develop the processes that tum the designers' concepts into physical reality. And while the silicon transistor is shrinking, the engineering challenges of packaging multiple chips and associated components into increasingly dense subsystems are growing. Further, the transistor may have to function without failure through severe industrial or military environments over the lifetime of the product.…

Zustand: New. Print on Demand pp. 396 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Zustand: New. PRINT ON DEMAND pp. 396.