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Hardcover. Zustand: New. In shrink wrap. Looks like an interesting title!
Anbieter: Chiron Media, Wallingford, Vereinigtes Königreich
EUR 301,04
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In den WarenkorbHardcover. Zustand: New.
EUR 303,99
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In den WarenkorbZustand: New.
Zustand: New.
Zustand: As New. Unread book in perfect condition.
EUR 330,80
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In den WarenkorbZustand: As New. Unread book in perfect condition.
Zustand: New. pp. 568.
EUR 325,10
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. M. Datta, Tetsuya Osaka, J. Walter SchultzeMicroelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the.
Zustand: New. pp. 568.
Sprache: Englisch
Verlag: Taylor & Francis Ltd Dez 2004, 2004
ISBN 10: 041531190X ISBN 13: 9780415311908
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Neuware - Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, then discusses chip metallization topics. It explores key aspects of chip-package interconnect technologies, and analyzes packages, boards, and connectors. It concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 351,63
Anzahl: 3 verfügbar
In den WarenkorbZustand: New. pp. 568 Illus. This item is printed on demand.