Isbn: 9780792392965 - boundary-scan test: a practical approach (24 Ergebnisse)

Paperback. Zustand: Like New. Most items will be dispatched the same or the next working day. An apparently unread copy in perfect condition. Dust cover is intact with no nicks or tears. Spine has no signs of creasing. Pages are clean and not marred by notes or folds of any kind.

Zustand: good. The book is in good condition with all pages and cover intact, including the dust jacket if originally issued. The spine may show light wear. Pages may contain some notes or highlighting, and there might be a "From the library of" label. Boxed set packaging, shrink wrap, or included media like CDs may be missing.…

Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,650grams, ISBN:9780792392965. …

Perfect Paperback. Zustand: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,650grams, ISBN:9780792392965. …

perfect. Zustand: New. In shrink wrap. Looks like an interesting title.

Zustand: Good. Ältere Ausgabe. Auflage: 1993.

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Zustand: New.

Zustand: New. In English.

Zustand: As New. Unread book in perfect condition.

Zustand: New. Provides an introduction and guidance to Boundary-Scan testing. This book is suitable for IC design and test engineers, and engineering managers. Num Pages: 225 pages, biography. BIC Classification: TJF; UY. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 235 x 155 x 13. Weight in Grams: 780. . 1992. Hardback. . . . . …

Zustand: New. pp. 248.

Zustand: gut. Boundary-Scan Test: A Practical Approach In englischer Sprache. pages.

Zustand: New. Provides an introduction and guidance to Boundary-Scan testing. This book is suitable for IC design and test engineers, and engineering managers. Num Pages: 225 pages, biography. BIC Classification: TJF; UY. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 235 x 155 x 13. Weight in Grams: 780. . 1992. Hardback. . . . . Books ship from the US and Ireland. …

Perfect Paperback. Zustand: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The ever-increasing miniaturization of digital electronic components is hampering the conventional testing of Printed Circuit Boards (PCBs) by means of bed-of-nails fixtures. Basically this is caused by the very high scale of integration of ICs, through which packages with hundreds of pins at very small pitches of down to a fraction of a millimetre, have become available. As a consequence the trace distances between the copper tracks on a printed circuit board cmne down to the same value. Not only the required small physical dimensions of the test nails have made conventional testing unfeasible, but also the complexity to provide test signals for the many hundreds of test nails has grown out of limits. Therefore a new board test methodology had to be invented. Following the evolution in the IC test technology. Boundary-Scan testing hm; become the new approach to PCB testing. By taking precautions in the design of the IC (design for testability), testing on PCB level can be simplified 10 a great extent. This condition has been essential for the success of the introduction of Boundary-Sc,m Test (BST) at board level. 244 pp. Englisch.…

Gebunden. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The ever-increasing miniaturization of digital electronic components is hampering the conventional testing of Printed Circuit Boards (PCBs) by means of bed-of-nails fixtures. Basically this is caused by the very high scale of integration of ICs, through whi. …

Buch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The ever-increasing miniaturization of digital electronic components is hampering the conventional testing of Printed Circuit Boards (PCBs) by means of bed-of-nails fixtures. Basically this is caused by the very high scale of integration of ICs, through which packages with hundreds of pins at very small pitches of down to a fraction of a millimetre, have become available. As a consequence the trace distances between the copper tracks on a printed circuit board cmne down to the same value. Not only the required small physical dimensions of the test nails have made conventional testing unfeasible, but also the complexity to provide test signals for the many hundreds of test nails has grown out of limits. Therefore a new board test methodology had to be invented. Following the evolution in the IC test technology. Boundary-Scan testing hm; become the new approach to PCB testing. By taking precautions in the design of the IC (design for testability), testing on PCB level can be simplified 10 a great extent. This condition has been essential for the success of the introduction of Boundary-Sc,m Test (BST) at board level.…

Buch. Zustand: Neu. Boundary-Scan Test | A Practical Approach | Harry Bleeker (u. a.) | Buch | xvi | Englisch | 1992 | Springer | EAN 9780792392965 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. …

Buch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The ever-increasing miniaturization of digital electronic components is hampering the conventional testing of Printed Circuit Boards (PCBs) by means of bed-of-nails fixtures. Basically this is caused by the very high scale of integration of ICs, through which packages with hundreds of pins at very small pitches of down to a fraction of a millimetre, have become available. As a consequence the trace distances between the copper tracks on a printed circuit board cmne down to the same value. Not only the required small physical dimensions of the test nails have made conventional testing unfeasible, but also the complexity to provide test signals for the many hundreds of test nails has grown out of limits. Therefore a new board test methodology had to be invented. Following the evolution in the IC test technology. Boundary-Scan testing hm; become the new approach to PCB testing. By taking precautions in the design of the IC (design for testability), testing on PCB level can be simplified 10 a great extent. This condition has been essential for the success of the introduction of Boundary-Sc,m Test (BST) at board level.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 244 pp. Englisch.…

Zustand: New. Print on Demand pp. 248 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.

Zustand: New. PRINT ON DEMAND pp. 248.