ISBN: 9780792394006 - simultaneous switching noise of cmos devices and systems (the springer international series in engineering and computer science, 249, band 249) (16 Ergebnisse)

Zustand: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail.…

Zustand: Very Good. hardcover. Page block firm and clean, binding unblemished, boards straight, without markings of any kind. Supporting Bay Area Friends of the Library since 2010. Well packaged and promptly shipped.

Hardcover. Zustand: Very Good. No Jacket. First Edition. Ex library with the usual blemishes. OX2745.

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Zustand: New.

Zustand: New. Covers research on package-induced noise problems in single and multi-chip package assemblies. This book examines the methods for calculating SSN and overall noise containment in a system. It is suitable for experienced engineers in packaging and systems areas and also for students entering these fields. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 205 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 14. Weight in Grams: 504. . 1993. Hardback. . . . .…

Zustand: As New. Unread book in perfect condition.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using Bipolar Junction Transistors (BJTs). This present work covers in-depth analysis on estimating SSN and its impact for CMOS based devices and systems. At present semiconductor industries are moving towards scaled CMOS devices and reduced supply voltage. SSN together with coupled noise may limit the packing density, and thereby the frequency of operation of packaged systems. Our goal is to provide efficient and yet reliable methodologies and algorithms to estimate the overall noise containment in single chip and multi-chip package assemblies. We hope that the techniques and results described in this book will be useful as guides for design, package, and system engineers and academia working in this area. Through this monograph, we hope that we have shown the necessity of interactions that are essential between chip design, system design and package design engineers to design and manufacture optimal packaged systems. Work reported in this monograph was partially supported by the grant from Semiconductor Research Corporation (SRC Contract No. 92-MP-086).…

Zustand: New. pp. 232.

Zustand: New. Covers research on package-induced noise problems in single and multi-chip package assemblies. This book examines the methods for calculating SSN and overall noise containment in a system. It is suitable for experienced engineers in packaging and systems areas and also for students entering these fields. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 205 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 14. Weight in Grams: 504. . 1993. Hardback. . . . . Books ship from the US and Ireland.…

Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using Bipolar Junction Transistors (BJTs). This present work covers in-depth analysis on estimating SSN and its impact for CMOS based devices and systems. At present semiconductor industries are moving towards scaled CMOS devices and reduced supply voltage. SSN together with coupled noise may limit the packing density, and thereby the frequency of operation of packaged systems. Our goal is to provide efficient and yet reliable methodologies and algorithms to estimate the overall noise containment in single chip and multi-chip package assemblies. We hope that the techniques and results described in this book will be useful as guides for design, package, and system engineers and academia working in this area. Through this monograph, we hope that we have shown the necessity of interactions that are essential between chip design, system design and package design engineers to design and manufacture optimal packaged systems. Work reported in this monograph was partially supported by the grant from Semiconductor Research Corporation (SRC Contract No. 92-MP-086). 230 pp. Englisch.…

Gebunden. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using.…

Buch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using Bipolar Junction Transistors (BJTs). This present work covers in-depth analysis on estimating SSN and its impact for CMOS based devices and systems. At present semiconductor industries are moving towards scaled CMOS devices and reduced supply voltage. SSN together with coupled noise may limit the packing density, and thereby the frequency of operation of packaged systems. Our goal is to provide efficient and yet reliable methodologies and algorithms to estimate the overall noise containment in single chip and multi-chip package assemblies. We hope that the techniques and results described in this book will be useful as guides for design, package, and system engineers and academia working in this area. Through this monograph, we hope that we have shown the necessity of interactions that are essential between chip design, system design and package design engineers to design and manufacture optimal packaged systems. Work reported in this monograph was partially supported by the grant from Semiconductor Research Corporation (SRC Contract No. 92-MP-086).Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 230 pp. Englisch.…

Zustand: New. Print on Demand pp. 232 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Zustand: New. PRINT ON DEMAND pp. 232.