9781489986122 - constrained deformation of materials: devices, heterogeneous structures and thermo-mechanical modeling von shen, y.-l. (9 Ergebnisse)
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Taschenbuch. Zustand: Neu. Constrained Deformation of Materials | Devices, Heterogeneous Structures and Thermo-Mechanical Modeling | Y. -L. Shen | Taschenbuch | ix | Englisch | 2014 | Springer | EAN 9781489986122 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[…at]springer[dot]com | Anbieter: preigu.
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - 'Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling' is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical def…ormations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme.Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.
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Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -'Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling' is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems…. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme.Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike. 292 pp. Englisch.
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Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presents constrained deformation capabilities in thin films and small-volume materialsLinks the microelectronics and composite materials fields through common principles and proper analytical approachesProvides a modeli…ng and mechanical analyses of advanced.
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Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -'Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling' is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Me…chanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme.Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 292 pp. Englisch.
