9783030934439 - Recent Progress in Lead-Free Solder Technology: Materials Development, Processing and Performances (Topics in Mining, Metallurgy and Materials Engineering) (10 Ergebnisse)

Zustand: New. In.

Taschenbuch. Zustand: Neu. Recent Progress in Lead-Free Solder Technology | Materials Development, Processing and Performances | Mohd Arif Anuar Mohd Salleh (u. a.) | Taschenbuch | Topics in Mining, Metallurgy and Materials Engineering | xii | Englisch | 2023 | Springer | EAN 9783030934439 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Zustand: New. 1st ed. 2022 edition NO-PA16APR2015-KAP.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials' development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Paperback. Zustand: Brand New. 340 pages. 9.25x6.10x0.71 inches. In Stock.

Zustand: new. Questo è un articolo print on demand.

Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials' development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder. 340 pp. Englisch.

Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials' development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 340 pp. Englisch.

Zustand: New. Print on Demand.

Zustand: New. PRINT ON DEMAND.