ISBN: 9783843377713 - rheological characterisation and modelling of electronic materials: time-dependent behaviours of lead-free solder pastes and flux mediums (8 Ergebnisse)

Zustand: New. pp. 224.

Taschenbuch. Zustand: Neu. Rheological Characterisation and Modelling of Electronic Materials | Time-dependent Behaviours of Lead-free Solder Pastes and Flux Mediums | Sabuj Mallik | Taschenbuch | 224 S. | Englisch | 2010 | LAP LAMBERT Academic Publishing | EAN 9783843377713 | Verantwortliche Person für die EU: BoD - Books on Demand, In de Tarpen 42, 22848 Norderstedt, info[at]bod[dot]de | Anbieter: preigu.…

Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The two most important trends in electronic industry are miniaturisation and increased functionality . As these trends are set to continue, there is an increasing demand for better understanding of soldering technology, particularly in the area of solder pastes used in the reflow soldering of surface mount devices. This means that the paste flow and deformation behaviour is very important in defining the printing performance of any solder paste. The work reported in this book is focused on experimetal investigation and empirical modelling of time-dependent rheological behaviours of solder paste and flux mediums. The printing trials of four different lead-free solder paste samples were also carried out to investigate the effect of post-print rest period on slumping behaviour of solder paste. The paste manufacturers and formulators can use the techniques developed to predict and quantify the slumping behaviour of solder paste.The end-users, for example the electronics assemblers may use the techniques to optimize their assembly process by minimising/preventing slumping of solder paste. 224 pp. Englisch.…

Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Mallik SabujDr Sabuj Mallik BSc, MSc, PhD: Lecturer in Engineering Materials at the University of Greenwich, UK. His research interest includes electronics materials and manufacturing, lead- free soldering, Rheological modelling an.…

Taschenbuch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The two most important trends in electronic industry are miniaturisation and increased functionality . As these trends are set to continue, there is an increasing demand for better understanding of soldering technology, particularly in the area of solder pastes used in the reflow soldering of surface mount devices. This means that the paste flow and deformation behaviour is very important in defining the printing performance of any solder paste. The work reported in this book is focused on experimetal investigation and empirical modelling of time-dependent rheological behaviours of solder paste and flux mediums. The printing trials of four different lead-free solder paste samples were also carried out to investigate the effect of post-print rest period on slumping behaviour of solder paste. The paste manufacturers and formulators can use the techniques developed to predict and quantify the slumping behaviour of solder paste.The end-users, for example the electronics assemblers may use the techniques to optimize their assembly process by minimising/preventing slumping of solder paste.…

Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The two most important trends in electronic industry are 'miniaturisation' and 'increased functionality'. As these trends are set to continue, there is an increasing demand for better understanding of soldering technology, particularly in the area of solder pastes used in the reflow soldering of surface mount devices. This means that the paste flow and deformation behaviour is very important in defining the printing performance of any solder paste. The work reported in this book is focused on experimetal investigation and empirical modelling of time-dependent rheological behaviours of solder paste and flux mediums. The printing trials of four different lead-free solder paste samples were also carried out to investigate the effect of post-print rest period on slumping behaviour of solder paste. The paste manufacturers and formulators can use the techniques developed to predict and quantify the slumping behaviour of solder paste.The end-users, for example the electronics assemblers may use the techniques to optimize their assembly process by minimising/preventing slumping of solder paste.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 224 pp. Englisch.…

Zustand: New. Print on Demand pp. 224 2:B&W 6 x 9 in or 229 x 152 mm Perfect Bound on Creme w/Gloss Lam.

Zustand: New. PRINT ON DEMAND pp. 224.