Applying composite model yield problem von warner (2 Ergebnisse)

Autor
Titel
Mit der Detailsuche verfeinern

Optimieren Sie Ihre Suche

  • Bücher (2)

bis

Benutzerdefinierte Preisspanne (EUR)

bis

  • Verlag: IREE Journal of Solid-State Circuits, 1974

    • Softcover

    Anbieter: Crossroad Books, Eau Claire, WI, USACrossroad Books

    Verkäufer/-in mit 5 Sternen
    Verkäufer/-in kontaktieren

    Zustand: Gebraucht - Gut

    EUR 20,18

    EUR 4,79 Versand 
    Versand innerhalb von USA

    Anzahl: 1 verfügbar

    In den Warenkorb

    Self-wraps. Zustand: Very Good. No Dust Jacket. This is a 10-page excerpt; an early reprint of pages 86-95 of the IREE Journal of Solid-State Circuits, Volume sc-9, Number 3. Clean. The pages are just a bit age-toned, but clean. ; 27C; 11" x 8-1/2"; 10 pages.

  • Weitere Bilder

    Zustand: Gebraucht - Gut

    EUR 43,04

    EUR 4,79 Versand 
    Versand innerhalb von USA

    Anzahl: 1 verfügbar

    In den Warenkorb

    Self-wraps. Zustand: Very Good. No Dust Jacket. This is a 10-page excerpt; an early reprint of pages 86-95 of the IREE Journal of Solid-State Circuits, Volume sc-9, Number 3. Clean. The pages are just a bit age-toned, but clean. Includes letters from the IEEE Journal of Solid-State Circuits, to the monograph author, one acknowledging the receipt of the manuscript for this monograph, and the 2nd indicating the acceptance of the monograph for publication (after suggested edits). Both letters have a paper-clip rust stain at the top edge, and one is stapled to the original envelope. Also includes ~30 letters from semiconductor industry figures to the author. Most from within the U. S., but also a couple from around the world. All on company letterheads. These letters requesting an advanced copy of the monograph, as announced in the Nov. 22, 1973 copy of Electronics Magazine. ; 27C; 11" x 8-1/2"; 10 pages.