Electronics assembly handbook (20 Ergebnisse)

Hardcover. Zustand: Good. No Jacket. 1st Edition. White, shiny cloth boards; slightly bumped corners; author in white & title in blue & white on front with a colour photo; author, title & pbl in blue & black on spine; intro to book on back. Cut edges clean bar the odd mark. Endpapers lightly tanned. Text block tight; pages clean; Contents Page at front; Index at end; numerous b/w illustrations in text. No jacket. …

Zustand: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.

Paperback. Zustand: Brand New. 354 pages. 10.00x7.25x0.80 inches. In Stock.

Paperback. Zustand: Brand New. reprint edition. 354 pages. 10.00x7.50x0.75 inches. In Stock.

gebundene Ausgabe. Zustand: Gut. 603 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 1600.…

Zustand: New.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.…

Zustand: New. pp. 628.

Paperback. Zustand: Brand New. reprint edition. 603 pages. 9.75x8.00x1.25 inches. In Stock.

Paperback. Zustand: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Zustand: As New. Unread book in perfect condition.

Zustand: gut. 1988. The Electronics Assembly Handbook. In deutscher Sprache. pages.

Zustand: New. Dive into the world of electronics with this foundational handbook, published by Shoeisha. This volume, the first in a series, serves as an excellent introduction to building electronic projects and understanding various components. It's perfect for hobbyists and students looking to grasp the basics of electronic craftsmanship. Note: The text is entirely in Japanese. Brand New Japanese Edition. Ships worldwide from Japan via Japan Post. Expedited shipping via FedEx available.…

Zustand: new. Questo è un articolo print on demand.

Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in Assembly Engineering and Elect.…

Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation. 628 pp. Englisch.…

Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 628 pp. Englisch.…

Zustand: New. Print on Demand pp. 628 39:B&W 8 x 10 in or 254 x 203mm Perfect Bound on White w/Gloss Lam.

Zustand: New. PRINT ON DEMAND pp. 628.