Zustand: New.
Sprache: Englisch
Verlag: World Scientific Pub Co Inc, 2024
ISBN 10: 9811277931 ISBN 13: 9789811277931
Anbieter: Kuba Libri, Prague, Tschechien
Hardcover. Zustand: New.
Sprache: Englisch
Verlag: World Scientific Publishing Company, 2024
ISBN 10: 9811277931 ISBN 13: 9789811277931
Anbieter: PBShop.store US, Wood Dale, IL, USA
HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
Zustand: As New. Unread book in perfect condition.
Sprache: Englisch
Verlag: World Scientific Publishing Company, 2024
ISBN 10: 9811277931 ISBN 13: 9789811277931
Anbieter: PBShop.store UK, Fairford, GLOS, Vereinigtes Königreich
EUR 168,44
Anzahl: 15 verfügbar
In den WarenkorbHRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
EUR 163,76
Anzahl: 10 verfügbar
In den WarenkorbZustand: New.
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
EUR 168,25
Anzahl: 10 verfügbar
In den WarenkorbZustand: As New. Unread book in perfect condition.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 172,89
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Sprache: Englisch
Verlag: World Scientific Pub Co Inc, 2024
ISBN 10: 9811277931 ISBN 13: 9789811277931
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 211,61
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 464 pages. 9.25x6.25x1.25 inches. In Stock.
Anbieter: preigu, Osnabrück, Deutschland
Buch. Zustand: Neu. EMBEDDED COOLING OF ELECTRONIC DEVICES | Iyengar Madhusudan | Buch | Englisch | 2024 | World Scientific | EAN 9789811277931 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.