Paperback. Zustand: Very Good. Ex-library paperback in very nice condition with the usual markings and attachments. Text block clean and unmarked. Tight binding.
Paperback. Zustand: Very Good. Ex-library paperback in very nice condition with the usual markings and attachments. Except for library markings, interior clean and unmarked. Tight binding.
Paperback. Zustand: Very Good. Ex-library paperback in very nice condition with the usual markings and attachments. Text block clean and unmarked. Tight binding.
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Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 769 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
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Taschenbuch. Zustand: Neu. Embedded and Ubiquitous Computing | IFIP International Conference, EUC 2007, Taipei, Taiwan, December 17-20, 2007, Proceedings | Tei-Wei Kuo (u. a.) | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2007 | Springer | EAN 9783540770916 | Verantwortliche Person für die EU: Springer Nature Customer Service Center GmbH, Europaplatz 3, 69115 Heidelberg, productsafety[at]springernature[dot]com | Anbieter: preigu.
Sprache: Englisch
Verlag: Springer-Verlag New York Inc, 2008
ISBN 10: 3540770917 ISBN 13: 9783540770916
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - It has been widely recognized that embedded and ubiquitous computing will have tremendous impacts on many aspects of our daily life. Innovation and close collaboration between academia and industry are the keys to guaranteeing success in the development and deployment of the technology in embedded and ubiquitous computing. TheIFIP InternationalConferenceonEmbeddedandUbiquitous Computing (EUC) provides a forum for engineers and scientists in academia, industry, and governmentto address challenges and to present and discuss their ideas, results, work in progress and experience. The Technical Program Committee (TPC) of EUC 2007 was lead by the TPC Chair, Tei-Wei Kuo, and TPC Vice Chairs. A strong international TPC was formed to review and evaluate the submissions. Each paper was reviewed carefully by at least three TPC members or external reviewers. It was extremely di cult for the TPC to select the presentations because there were so many excellent and interesting submissions. There were 217 submissions from all over the world, and only 65 papers are published in this proceedings volume.
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Taschenbuch. Zustand: Neu. Neuware - Welcome to the proceedings of the 2004 International Conference on Embedded and Ubiquitous Computing (EUC 2004) which was held in Aizu-Wakamatsu City, Japan, 25-27 August 2004. Embedded and ubiquitous computing are emerging rapidly as exciting new paradigms and disciplines to provide computing and communication services all the time, everywhere. Its systems are now invading every aspect of life to the point that they are disappearing inside all sorts of appliances or can be worn unobtrusively as part of clothing and jewelry, etc. This emergence is a natural outcome of research and technological advances in embedded systems, pervasive computing and communications, wireless networks, mobile computing, distri- ted computing and agent technologies, etc. Its explosive impact on academia, industry, government and daily life can be compared to that of electric motors over the past century but promises to revolutionize life much more profoundly than elevators, electric motors or even personal computer evolution ever did. The EUC 2004 conference provided a forum for engineers and scientists in academia, industry, and government to address all the resulting profound ch- lenges including technical, safety, social, legal, political, and economic issues, and to present and discuss their ideas, results, work in progress and experience on all aspects of embedded and ubiquitous computing. There was a very large number of paper submissions (260) from more than 20countriesandregions,includingnotonlyAsiaandthePaci c,butalsoEurope and North America. All submissions were reviewed by at least three program or technical committee members or external reviewers.
Sprache: Englisch
Verlag: Springer-Verlag New York Inc, 2006
ISBN 10: 3540366792 ISBN 13: 9783540366799
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