Verlag: Springer International Publishing, Springer International Publishing, 2018
ISBN 10: 3030093239 ISBN 13: 9783030093235
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
EUR 96,29
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbTaschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.
Verlag: Springer International Publishing, Springer International Publishing Dez 2018, 2018
ISBN 10: 3030093239 ISBN 13: 9783030093235
Sprache: Englisch
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
EUR 96,29
Währung umrechnenAnzahl: 2 verfügbar
In den WarenkorbTaschenbuch. Zustand: Neu. Neuware -This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author¿s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 134,75
Währung umrechnenAnzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Verlag: Springer International Publishing, Springer International Publishing Mär 2018, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Sprache: Englisch
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
EUR 139,09
Währung umrechnenAnzahl: 2 verfügbar
In den WarenkorbBuch. Zustand: Neu. Neuware -This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author¿s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
Verlag: Springer International Publishing, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
EUR 139,09
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbBuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.
Anbieter: Best Price, Torrance, CA, USA
EUR 122,01
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In den WarenkorbZustand: New. SUPER FAST SHIPPING.
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In den WarenkorbZustand: New.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
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In den WarenkorbPaperback. Zustand: Brand New. reprint edition. 188 pages. 9.25x6.10x0.43 inches. In Stock.
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In den WarenkorbPaperback. Zustand: New. New. book.
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In den WarenkorbZustand: New.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
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In den WarenkorbHardcover. Zustand: Brand New. 187 pages. 9.25x6.10x0.71 inches. In Stock.
Verlag: Springer International Publishing, 2018
ISBN 10: 3030093239 ISBN 13: 9783030093235
Sprache: Englisch
Anbieter: moluna, Greven, Deutschland
EUR 81,44
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In den WarenkorbZustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) productsProvides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms.
Verlag: Springer International Publishing Dez 2018, 2018
ISBN 10: 3030093239 ISBN 13: 9783030093235
Sprache: Englisch
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
EUR 96,29
Währung umrechnenAnzahl: 2 verfügbar
In den WarenkorbTaschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. 188 pp. Englisch.
Verlag: Springer International Publishing, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Sprache: Englisch
Anbieter: moluna, Greven, Deutschland
EUR 115,65
Währung umrechnenAnzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) productsProvides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms.
Verlag: Springer International Publishing Mrz 2018, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Sprache: Englisch
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
EUR 139,09
Währung umrechnenAnzahl: 2 verfügbar
In den WarenkorbBuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. 188 pp. Englisch.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 169,87
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In den WarenkorbZustand: New. Print on Demand.
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
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In den WarenkorbZustand: New. PRINT ON DEMAND.