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Verlag: Springer-Verlag New York Inc., New York, NY, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Sprache: Englisch
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In den WarenkorbPaperback. Zustand: new. Paperback. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Verlag: Springer-Verlag New York Inc., New York, NY, 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Sprache: Englisch
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In den WarenkorbHardcover. Zustand: new. Hardcover. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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In den WarenkorbZustand: New. 2012. Paperback. . . . . . Books ship from the US and Ireland.
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Verlag: Springer US, Springer New York, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Sprache: Englisch
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In den WarenkorbTaschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
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In den WarenkorbBuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
Verlag: Springer-Verlag New York Inc., New York, NY, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Sprache: Englisch
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In den WarenkorbPaperback. Zustand: new. Paperback. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Verlag: Springer-Verlag New York Inc., 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Sprache: Englisch
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In den WarenkorbZustand: New. 3D-Integration for NoC-based SoC Architectures gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. Editor(s): Sheibanyrad, Abbas; Petrot, Frederic; Jantsch, Axel. Series: Integrated Circuits and Systems. Num Pages: 278 pages, biography. BIC Classification: TJFC; UMZ. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 17. Weight in Grams: 584. . 2010. Hardback. . . . .
Verlag: Springer-Verlag New York Inc., 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Sprache: Englisch
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EUR 283,20
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In den WarenkorbZustand: New. 3D-Integration for NoC-based SoC Architectures gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. Editor(s): Sheibanyrad, Abbas; Petrot, Frederic; Jantsch, Axel. Series: Integrated Circuits and Systems. Num Pages: 278 pages, biography. BIC Classification: TJFC; UMZ. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 17. Weight in Grams: 584. . 2010. Hardback. . . . . Books ship from the US and Ireland.
Verlag: Springer-Verlag New York Inc., New York, NY, 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Sprache: Englisch
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In den WarenkorbHardcover. Zustand: new. Hardcover. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Verlag: Springer New York Dez 2012, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Sprache: Englisch
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
EUR 117,69
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In den WarenkorbTaschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 288 pp. Englisch.