Zustand: As New. Unread book in perfect condition.
Zustand: New.
PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
Sprache: Englisch
Verlag: Taylor and Francis Ltd, GB, 2024
ISBN 10: 1032489502 ISBN 13: 9781032489506
Anbieter: Rarewaves.com USA, London, LONDO, Vereinigtes Königreich
EUR 32,13
Anzahl: 1 verfügbar
In den WarenkorbPaperback. Zustand: New. This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications. Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nonvolatile memory applications owing to its superior characteristics including simple structure, high switching speed, low power consumption, and compatibility with standard complementary metal oxide semiconductor (CMOS) process. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts:1: Associative Problems in Crossbar array and 3D architectures;2: Selector Devices and Self-Selective Cells; 3: Integration of 3D RRAM; 4: Reliability Issues in 3D RRAM; 5: Applications of 3D RRAM beyond Storage.The book aspires to provide a relevant reference for students, researchers, engineers, and professionals working with resistive random-access memory or those interested in 3D integration technology in general.
Anbieter: PBShop.store UK, Fairford, GLOS, Vereinigtes Königreich
EUR 28,83
Anzahl: 1 verfügbar
In den WarenkorbPAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 30,96
Anzahl: 3 verfügbar
In den WarenkorbZustand: New. pages cm.
Anbieter: Books Puddle, New York, NY, USA
Zustand: New. pages cm First edition Includes bibliographical references.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 29,25
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
EUR 25,94
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New.
Anbieter: THE SAINT BOOKSTORE, Southport, Vereinigtes Königreich
EUR 29,14
Anzahl: 1 verfügbar
In den WarenkorbPaperback / softback. Zustand: New. New copy - Usually dispatched within 4 working days.
Anbieter: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irland
Zustand: New.
Anbieter: Chiron Media, Wallingford, Vereinigtes Königreich
EUR 26,06
Anzahl: 1 verfügbar
In den Warenkorbpaperback. Zustand: New.
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
EUR 29,81
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: As New. Unread book in perfect condition.
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Zustand: New. pages cm.
Anbieter: Kennys Bookstore, Olney, MD, USA
Zustand: New.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 40,44
Anzahl: 2 verfügbar
In den WarenkorbPaperback. Zustand: Brand New. 106 pages. 8.50x5.43x8.50 inches. In Stock.
Zustand: New.
Sprache: Englisch
Verlag: Taylor & Francis Ltd, London, 2023
ISBN 10: 103248943X ISBN 13: 9781032489438
Anbieter: Grand Eagle Retail, Bensenville, IL, USA
Hardcover. Zustand: new. Hardcover. This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications. Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nonvolatile memory applications owing to its superior characteristics including simple structure, high switching speed, low power consumption, and compatibility with standard complementary metal oxide semiconductor (CMOS) process. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts:1: Associative Problems in Crossbar array and 3D architectures;2: Selector Devices and Self-Selective Cells; 3: Integration of 3D RRAM; 4: Reliability Issues in 3D RRAM; 5: Applications of 3D RRAM beyond Storage.The book aspires to provide a relevant reference for students, researchers, engineers, and professionals working with resistive random-access memory or those interested in 3D integration technology in general. This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures, to its applications. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Zustand: As New. Unread book in perfect condition.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 78,01
Anzahl: 3 verfügbar
In den WarenkorbZustand: New.
Anbieter: Books Puddle, New York, NY, USA
Zustand: New. 1st edition NO-PA16APR2015-KAP.
Anbieter: THE SAINT BOOKSTORE, Southport, Vereinigtes Königreich
EUR 72,65
Anzahl: 1 verfügbar
In den WarenkorbHardback. Zustand: New. New copy - Usually dispatched within 4 working days.
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
EUR 74,06
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: As New. Unread book in perfect condition.
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
EUR 72,64
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New.
Taschenbuch. Zustand: Neu. 3D Integration of Resistive Switching Memory | Qing Luo | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2024 | CRC Press | EAN 9781032489506 | Verantwortliche Person für die EU: Taylor & Francis Verlag GmbH, Kaufingerstr. 24, 80331 München, gpsr[at]taylorandfrancis[dot]com | Anbieter: preigu.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 84,40
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Sprache: Englisch
Verlag: Taylor and Francis Ltd, GB, 2024
ISBN 10: 1032489502 ISBN 13: 9781032489506
Anbieter: Rarewaves.com UK, London, Vereinigtes Königreich
EUR 29,16
Anzahl: 1 verfügbar
In den WarenkorbPaperback. Zustand: New. This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications. Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nonvolatile memory applications owing to its superior characteristics including simple structure, high switching speed, low power consumption, and compatibility with standard complementary metal oxide semiconductor (CMOS) process. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts:1: Associative Problems in Crossbar array and 3D architectures;2: Selector Devices and Self-Selective Cells; 3: Integration of 3D RRAM; 4: Reliability Issues in 3D RRAM; 5: Applications of 3D RRAM beyond Storage.The book aspires to provide a relevant reference for students, researchers, engineers, and professionals working with resistive random-access memory or those interested in 3D integration technology in general.
Sprache: Englisch
Verlag: Taylor & Francis Ltd, London, 2023
ISBN 10: 103248943X ISBN 13: 9781032489438
Anbieter: AussieBookSeller, Truganina, VIC, Australien
Hardcover. Zustand: new. Hardcover. This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications. Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nonvolatile memory applications owing to its superior characteristics including simple structure, high switching speed, low power consumption, and compatibility with standard complementary metal oxide semiconductor (CMOS) process. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts:1: Associative Problems in Crossbar array and 3D architectures;2: Selector Devices and Self-Selective Cells; 3: Integration of 3D RRAM; 4: Reliability Issues in 3D RRAM; 5: Applications of 3D RRAM beyond Storage.The book aspires to provide a relevant reference for students, researchers, engineers, and professionals working with resistive random-access memory or those interested in 3D integration technology in general. This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures, to its applications. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 102,45
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 128 pages. 8.50x5.44x0.43 inches. In Stock.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 31,07
Anzahl: 1 verfügbar
In den WarenkorbPaperback. Zustand: Brand New. 106 pages. 8.50x5.43x8.50 inches. In Stock. This item is printed on demand.