large scale integration systems (155 Ergebnisse)

Hardback. Zustand: Good. The book has been read but remains in clean condition. All pages are intact and the cover is intact. Some minor wear to the spine.

Softcover. Zustand: Très bon. Ancien livre de bibliothèque. Couverture différente. Jaquette abîmée. Edition 1981. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Very good. Former library book. Different cover. Damaged dust jacket. Edition 1981. Ammareal gives back up to 15% of this item's net price to charity organizations.

Zustand: Good. 678 pp., Hardcover, ex library, else text and binding clean and tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.

Zustand: Poor. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In poor condition, suitable as a reading copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1000grams, ISBN:0201043580.

Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Dust jacket in good condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,500grams, ISBN:9780333408216.

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 200 | Sprache: Englisch | Produktart: Bücher.

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 368 | Sprache: Englisch | Produktart: Bücher.

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 212 | Sprache: Englisch | Produktart: Bücher.

Hardcover. Zustand: New. US SELLER SHIPS FAST FROM USA.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, held in Madrid, Spain, in September 2010. The 14 papers included in the book were carefully reviewed and selected from the 52 full papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.

Zustand: New. In.

Zustand: New. In.

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 394 | Sprache: Englisch | Produktart: Sonstiges.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers that were presented during the fourteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 14th conference was held at the Hotel Boscolo, Nice, France (October 16-18, 2006). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt and Perth. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5 and by the IEEE Council on Electronic Design Automation (CEDA), is to provide a forum to exchange ideas and show industrial and academic research results in the field of microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI- SOC conferences aim to address these exciting new issues.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers that were presented during the fifteenth edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 15th conference was held at the Georgia Institute of Technology, Atlanta, USA (October 15-17, 2007). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth and Nice. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5 and by the IEEE Council on Electronic Design Automation (CEDA), is to provide a forum to exchange ideas and show industrial and academic research results in the field of microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI-SoC conferences aim to address these exciting new issues.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers that were presented during the thirteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD conference. The 13th conference was held at the Parmelia Hilton Hotel, Perth, Western Australia (October 17-19, 2005). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier and Darmstadt. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show industrial and academic research results in the field of mic- electronics design. The current trend toward increasing chip integ- tion and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI-SOC conferences aim to address these exciting new issues. The 2005 edition of VLSI-SoC maintained the traditional structure, which has been successful at the previous VLSI-SOC conferences. The quality of submissions (107 papers from 26 countries) made the selection process difficult, but finally 63 papers and 25 posters were accepted for presentation in VLSI-SoC 2005. Out of the 63 full papers presented at the conference, 20 were chosen by a selection committee to have an extended and revised version included in this book. These selected papers came from Australia, Brazil, France, Germany, Italy, Korea, Portugal, Sweden, Switzerland, United Kingdom and the United States of America. x Preface.

Hardcover. Zustand: Very Good. Zustand des Schutzumschlags: Good. In DJ; 346 pages.

gebundene Ausgabe. Zustand: Gut. 477 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 800.

Gebunden. Zustand: New. Zongxiang Lu, Tsinghua University, ChinaShuangxi Zhou, Tsinghua University, ChinaWritten with power system engineers in mind, this book presents the technical issues faced when integrating large scale wind turbines into the power system networks based o.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Paperback. Zustand: Brand New. 316 pages. 9.00x6.00x0.74 inches. In Stock.

Buch. Zustand: Neu. Neuware - This book contains extended and revised versions of the best papers that were presented during the fifteenth edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 15th conference was held at the Georgia Institute of Technology, Atlanta, USA (October 15-17, 2007). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth and Nice. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5 and by the IEEE Council on Electronic Design Automation (CEDA), is to provide a forum to exchange ideas and show industrial and academic research results in the field of microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI-SoC conferences aim to address these exciting new issues.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book outlines the challenges that increasing amounts of renewable and distributed energy represent when integrated into established electricity grid infrastructures, offering a range of potential solutions that will support engineers, grid operators, system planners, utilities, and policymakers alike in their efforts to realize the vision of moving toward greener, more secure energy portfolios. Covering all major renewable sources, from wind and solar, to waste energy and hydropower, the authors highlight case studies of successful integration scenarios to demonstrate pathways toward overcoming the complexities created by variable and distributed generation.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book outlines the challenges that increasing amounts of renewable and distributed energy represent when integrated into established electricity grid infrastructures, offering a range of potential solutions that will support engineers, grid operators, system planners, utilities, and policymakers alike in their efforts to realize the vision of moving toward greener, more secure energy portfolios. Covering all major renewable sources, from wind and solar, to waste energy and hydropower, the authors highlight case studies of successful integration scenarios to demonstrate pathways toward overcoming the complexities created by variable and distributed generation.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The 11 th IFIP International Conference on Very Large Scale Integration, in Montpellier, France, December 3-5,2001, was a great success. The main focus was about IP Cores, Circuits and System Designs & Applications as well as SOC Design Methods and CAD. This book contains the best papers (39 among 70) that have been presented during the conference. Those papers deal with all aspects of importance for the design of the current and future integrated systems. System on Chip (SOC) design is today a big challenge for designers, as a SOC may contain very different blocks, such as microcontrollers, DSPs, memories including embedded DRAM, analog, FPGA, RF front-ends for wireless communications and integrated sensors. The complete design of such chips, in very deep submicron technologies down to 0.13 mm, with several hundreds of millions of transistors, supplied at less than 1 Volt, is a very challenging task if design, verification, debug and industrial test are considered. The microelectronic revolution is fascinating; 55 years ago, in late 1947, the transistor was invented, and everybody knows that it was by William Shockley, John Bardeen and Walter H. Brattein, Bell Telephone Laboratories, which received the Nobel Prize in Physics in 1956. Probably, everybody thinks that it was recognized immediately as a major invention.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - For over three decades now, silicon capacity has steadily been doubling every year and a half with equally staggering improvements continuously being observed in operating speeds. This increase in capacity has allowed for more complex systems to be built on a single silicon chip. Coupled with this functionality increase, speed improvements have fueled tremendous advancements in computing and have enabled new multi-media applications. Such trends, aimed at integrating higher levels of circuit functionality are tightly related to an emphasis on compactness in consumer electronic products and a widespread growth and interest in wireless communications and products. These trends are expected to persist for some time as technology and design methodologies continue to evolve and the era of Systems on a Chip has definitely come of age. While technology improvements and spiraling silicon capacity allow designers to pack more functions onto a single piece of silicon, they also highlight a pressing challenge for system designers to keep up with such amazing complexity. To handle higher operating speeds and the constraints of portability and connectivity, new circuit techniques have appeared. Intensive research and progress in EDA tools, design methodologies and techniques is required to empower designers with the ability to make efficient use of the potential offered by this increasing silicon capacity and complexity and to enable them to design, test, verify and build such systems.