Materials processes reliability advanced von edited martin (2 Ergebnisse)
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Edited by Martin Gall , Alfred Grill , Francesca Lacopi , Junichi Koike , Takamasa Usui
- Hardcover
- Erstausgabe
Anbieter: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandKennys Bookshop and Art Galleries Ltd.
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 140,88
EUR 9,50 VersandVersand von Irland nach USAAnzahl: Mehr als 20 verfügbar
Zustand: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U) Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . .…
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Edited by Martin Gall , Alfred Grill , Francesca Lacopi , Junichi Koike , Takamasa Usui
- Hardcover
Anbieter: Kennys Bookstore, Olney, MD, USAKennys Bookstore
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 180,10
EUR 9,23 VersandVersand innerhalb von USAAnzahl: Mehr als 20 verfügbar
Zustand: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U) Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . . Books ship from the US and Ireland.…
