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Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as ¿More than Moore¿ (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to ¿Moore's Law¿. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
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Taschenbuch. Zustand: Neu. More than Moore Technologies for Next Generation Computer Design | Rasit O. Topaloglu | Taschenbuch | ix | Englisch | 2016 | Springer | EAN 9781493947102 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Sprache: Englisch
Verlag: Springer New York, Springer US, 2016
ISBN 10: 1493947109 ISBN 13: 9781493947102
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as 'More than Moore' (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to 'Moore's Law'. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
Sprache: Englisch
Verlag: Springer New York, Springer New York, 2015
ISBN 10: 1493921622 ISBN 13: 9781493921621
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as 'More than Moore' (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to 'Moore's Law'. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
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Sprache: Englisch
Verlag: Springer New York Okt 2016, 2016
ISBN 10: 1493947109 ISBN 13: 9781493947102
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Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as 'More than Moore' (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to 'Moore's Law'. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect. 228 pp. Englisch.
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Verlag: Springer New York Feb 2015, 2015
ISBN 10: 1493921622 ISBN 13: 9781493921621
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Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as 'More than Moore' (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to 'Moore's Law'. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect. 228 pp. Englisch.
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Sprache: Englisch
Verlag: Springer, Springer Okt 2016, 2016
ISBN 10: 1493947109 ISBN 13: 9781493947102
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Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as ¿More than Moore¿ (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to ¿Moore's Law¿. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 228 pp. Englisch.
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Buch. Zustand: Neu. More than Moore Technologies for Next Generation Computer Design | Rasit O. Topaloglu | Buch | ix | Englisch | 2015 | Springer | EAN 9781493921621 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Sprache: Englisch
Verlag: Springer, Springer Feb 2015, 2015
ISBN 10: 1493921622 ISBN 13: 9781493921621
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Buch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as ¿More than Moore¿ (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to ¿Moore's Law¿. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 228 pp. Englisch.