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Verlag: Taylor & Francis Ltd, London, 2025
ISBN 10: 1032363827 ISBN 13: 9781032363820
Sprache: Englisch
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Paperback. Zustand: new. Paperback. Aggressive scaling of device and interconnect dimensions has resulted in many low-dimensional issues in the nanometer regime. This book deals with various new-generation interconnect materials and interconnect modeling, and highlights the significance of novel nano-interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: Focuses on materials and nanomaterials utilization in next-generation interconnects based on carbon nanotubes (CNT) and graphene nanoribbons (GNR). Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. Describes hybrid CNT- and GNR-based interconnects. Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, and nano-/microelectronics. This book deals with various new generation interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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ISBN 10: 1032363827 ISBN 13: 9781032363820
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In den WarenkorbPaperback. Zustand: new. Paperback. Aggressive scaling of device and interconnect dimensions has resulted in many low-dimensional issues in the nanometer regime. This book deals with various new-generation interconnect materials and interconnect modeling, and highlights the significance of novel nano-interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: Focuses on materials and nanomaterials utilization in next-generation interconnects based on carbon nanotubes (CNT) and graphene nanoribbons (GNR). Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. Describes hybrid CNT- and GNR-based interconnects. Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, and nano-/microelectronics. This book deals with various new generation interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Verlag: Taylor & Francis Ltd, London, 2025
ISBN 10: 1032363827 ISBN 13: 9781032363820
Sprache: Englisch
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Paperback. Zustand: new. Paperback. Aggressive scaling of device and interconnect dimensions has resulted in many low-dimensional issues in the nanometer regime. This book deals with various new-generation interconnect materials and interconnect modeling, and highlights the significance of novel nano-interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: Focuses on materials and nanomaterials utilization in next-generation interconnects based on carbon nanotubes (CNT) and graphene nanoribbons (GNR). Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. Describes hybrid CNT- and GNR-based interconnects. Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, and nano-/microelectronics. This book deals with various new generation interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. This item is printed on demand. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
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Taschenbuch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book deals with various new generation interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis.
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Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Aggressive scaling of device and interconnect dimensions has resulted in many low-dimensional issues in the nanometer regime. This book deals with various new-generation interconnect materials and interconnect modeling, and highlights the significance of novel nano-interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: - Focuses on materials and nanomaterials utilization in next-generation interconnects based on carbon nanotubes (CNT) and graphene nanoribbons (GNR). - Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. - Describes hybrid CNT- and GNR-based interconnects. - Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. - Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, and nano-/microelectronics. 212 pp. Englisch.
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In den WarenkorbZustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Sandip Bhattacharya received his Ph.D. (Eng.) degree from the Indian Institute of Engineering Science and Technology (IIEST), India, in 2017. From October 2017 to December 2020, he worked as a postdoctoral researcher at the HiSIM researc.
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Aggressive scaling of device and interconnect dimensions has resulted in many low-dimensional issues in the nanometer regime. This book deals with various new-generation interconnect materials and interconnect modeling, and highlights the significance of novel nano-interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: - Focuses on materials and nanomaterials utilization in next-generation interconnects based on carbon nanotubes (CNT) and graphene nanoribbons (GNR). - Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. - Describes hybrid CNT- and GNR-based interconnects. - Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. - Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, and nano-/microelectronics.
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Buch. Zustand: Neu. Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design | Sandip Bhattacharya (u. a.) | Buch | Einband - fest (Hardcover) | Englisch | 2023 | CRC Press | EAN 9781032363813 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.