Anbieter: Phatpocket Limited, Waltham Abbey, HERTS, Vereinigtes Königreich
EUR 19,51
Anzahl: 4 verfügbar
In den WarenkorbZustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
Sprache: Englisch
Verlag: Longman Scientific and Technical, 1995
ISBN 10: 0582087821 ISBN 13: 9780582087828
Anbieter: Anybook.com, Lincoln, Vereinigtes Königreich
EUR 32,92
Anzahl: 1 verfügbar
In den WarenkorbZustand: Poor. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In poor condition, suitable as a reading copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,800grams, ISBN:9780582087828.
Sprache: Englisch
Verlag: LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659833363 ISBN 13: 9783659833366
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 104,23
Anzahl: 1 verfügbar
In den WarenkorbPaperback. Zustand: Brand New. 212 pages. 8.66x5.91x0.48 inches. In Stock.
Sprache: Englisch
Verlag: LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659833363 ISBN 13: 9783659833366
Anbieter: Books Puddle, New York, NY, USA
Zustand: New.
Sprache: Englisch
Verlag: LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659833363 ISBN 13: 9783659833366
Anbieter: preigu, Osnabrück, Deutschland
Taschenbuch. Zustand: Neu. Polymer Composites for Microelectronic Applications | Micro-sized Particulate Filled Polymer Composites | Alok Agrawal (u. a.) | Taschenbuch | 212 S. | Englisch | 2016 | LAP LAMBERT Academic Publishing | EAN 9783659833366 | Verantwortliche Person für die EU: BoD - Books on Demand, In de Tarpen 42, 22848 Norderstedt, info[at]bod[dot]de | Anbieter: preigu.
Sprache: Englisch
Verlag: Nova Science Publishers, Incorporated, 2010
ISBN 10: 1608769992 ISBN 13: 9781608769995
Anbieter: Books Puddle, New York, NY, USA
Zustand: New. pp. xvii + 282 Index.
Sprache: Englisch
Verlag: Nova Science Publishers, Incorporated, 2010
ISBN 10: 1608769992 ISBN 13: 9781608769995
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 358,66
Anzahl: 1 verfügbar
In den WarenkorbZustand: New. pp. xvii + 282 Illus.
Sprache: Englisch
Verlag: Nova Science Publishers, Incorporated, 2010
ISBN 10: 1608769992 ISBN 13: 9781608769995
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Zustand: New. pp. xvii + 282.
Sprache: Englisch
Verlag: LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659833363 ISBN 13: 9783659833366
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 120,70
Anzahl: 4 verfügbar
In den WarenkorbZustand: New. Print on Demand.
Sprache: Englisch
Verlag: LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659833363 ISBN 13: 9783659833366
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Zustand: New. PRINT ON DEMAND.
Sprache: Englisch
Verlag: LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659833363 ISBN 13: 9783659833366
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The objective of the book is to report on the possibility of using ceramic fillers in polymers to make composites suitable for microelectronic applications. The first part of the book is on the development of theoretical heat conduction models for estimation of effective thermal conductivity of such polymer composites with single/hybrid fillers. The second part has provided the description of the materials used, routes adopted to fabricate the various composites and the details of the experiments. The last part has emphasized on the physical, mechanical, thermal and dielectric characteristics of all the epoxy and polypropylene based composites filled with single filler i.e. micro-sized AlN/Al2O3. A comparative evaluation of the effects of premixing of solid glass microspheres with AlN/Al2O3 is also presented. The polymer composites developed with enhanced thermal conductivity, improved glass transition temperature, reduced thermal expansion coefficient and modified dielectric constant are expected to have adequate potential for a wide variety of applications particularly in microelectronic industries like electronic packaging, encapsulations, printed circuit board substrates etc.